Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Chemically Bonded Thermally Expandable Microsphere-silica Composite Aerogel with Thermal Insulation Property for Industrial Use

  • Lee, Kyu-Yeon (Department of Materials Science and Engineering, Yonsei University) ;
  • Phadtare, Varsha D. (Department of Materials Science and Engineering, Yonsei University) ;
  • Choi, Haryeong (Department of Materials Science and Engineering, Yonsei University) ;
  • Moon, Seung Hwan (Enterprise Research Institute, Eslin Corporation) ;
  • Kim, Jong Il (Enterprise Research Institute, Eslin Corporation) ;
  • Bae, Young Kwang (Enterprise Research Institute, Eslin Corporation) ;
  • Park, Hyung-Ho (Department of Materials Science and Engineering, Yonsei University)
  • Received : 2019.06.10
  • Accepted : 2019.06.28
  • Published : 2019.06.30
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Abstract

Thermally expandable microsphere and aerogel composite was prepared by chemical compositization. Microsphere can produce synergies with aerogel, especially an enhancement of mechanical property. Through condensation between sulfonated microsphere and hydrolyzed silica sol, chemically-connected composite aerogel could be prepared. The presence of hydroxyl group on the sulfonated microsphere was observed, which was the prime functional group of reaction with hydrolyzed silica sol. Silica aerogel-coated microsphere was confirmed through microstructure analysis. The presence of silicon-carbon absorption band and peaks from composite aerogel was observed, which proved the chemical bonding between them. A relatively low thermal conductivity value of $0.063W/m{\cdot}K$ was obtained.

Keywords

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Fig. 1. Synthesis process of sulfonation of thermally expandable microsphere.

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Fig. 2. Synthesis process of sulfonation of microsphere and thermally expandable microsphere-silica composite aerogel.

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Fig. 3. FT-IR spectra of pristine microsphere (black line) and functionalized microspheres (red line).

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Fig. 4. FT-IR spectra of (a) pristine silica aerogel and (b) thermally expandable microsphere-silica composite aerogel.

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Fig. 5. SEM images of (a) thermally expandable microsphere, (b) pristine silica aerogel, (c) thermally expandable microsphere-silica composite aerogel and (d) the EDS result of thermally expandable microsphere-silica composite aerogel.

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Fig. 6. TGA result of pristine thermally expandable microsphere and thermally expandable microsphere-silica composite aerogel.

Table 1. Thermal conductivity of pristine silicone resin and mixture of silicone resin and thermally expandable microsphere-silica composite aerogel

MOKRBW_2019_v26n2_23_t0001.png 이미지

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