Electronic Materials Letters

  • 제14권6호
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  • Pages.678-688
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  • 2018
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  • 1738-8090(pISSN)
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  • 2093-6788(eISSN)
대한금속재료학회 (The Korean Institute of Metals and Materials)
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Oxidation and Repeated-Bending Properties of Sn-Based Solder Joints After Highly Accelerated Stress Testing (HAST)

  • Kim, Jeonga (Department of Materials Science and Engineering, Pusan National University) ;
  • Park, Cheolho (Department of Materials Science and Engineering, Pusan National University) ;
  • Cho, Kyung-Mox (Department of Materials Science and Engineering, Pusan National University) ;
  • Hong, Wonsik (Components and Materials Physics Research Center, Korea Electronic Technology Institute) ;
  • Bang, Jung-Hwan (Microjoining Center, Korea Institute of Industrial Technology) ;
  • Ko, Yong-Ho (Microjoining Center, Korea Institute of Industrial Technology) ;
  • Kang, Namhyun (Department of Materials Science and Engineering, Pusan National University)
  • 투고 : 2018.04.11
  • 심사 : 2018.05.30
  • 발행 : 2018.11.10
⟨ 이전 논문 다음 논문 ⟩

초록

The repeated-bending properties of Sn-0.7Cu, Sn-0.3Ag-0.7Cu (SAC0307), and Sn-3.0Ag-0.5Cu (SAC305) solders mounted on flexible substrates were studied using highly accelerated stress testing (HAST), followed by repeated-bending testing. In the Sn-0.7Cu joints, the $Cu_6Sn_5$ intermetallic compound (IMC) coarsened as the HAST time increased. For the SAC0307 and SAC305 joints, the $Ag_3Sn$ and $Cu_6Sn_5$ IMCs coarsened mainly along the grain boundary as the HAST time increased. The Sn-0.7Cu solder had a high contact angle, compared to the SAC0307 and SAC305 solders; consequently, the SAC0307 and SAC305 solder joints displayed smoother fillet shapes than the Sn-0.7Cu solder joint. The repeated-bending for the Sn-0.7Cu solder produced the crack initiated from the interface between the Cu lead wire and the solder, and that for the SAC solders indicated the cracks initiated at the surface, but away from the interface between the Cu lead wire and the solder. Furthermore, the oxide layer was thickest for Sn-0.7Cu and thinnest for SAC305, regardless of the HAST time. For the SAC solders, the crack initiation rate increased as the oxide layer thickened and roughened. $Cu_6Sn_5$ precipitated and grew along the grain and subgrain boundaries as the HAST time increased, embrittling the grain boundary at the crack propagation site.

키워드

과제정보

연구 과제번호 : Development of SiC Automotive OBC Power Module with Environment-Friendly High-Temperature Bonding Materials

연구 과제 주관 기관 : Ministry of Trade, Industry & Energy (MOTIE), National Research Foundation of Korea (NRF)

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피인용 문헌

  1. Pressure-Assisted Sinter-Bonding Characteristics at 250 °C in Air Using Bimodal Ag-Coated Cu Particles vol.16, pp.3, 2018, https://doi.org/10.1007/s13391-020-00208-1