DOI QR코드

DOI QR Code

협대역 고출력 전자기파에 의한 CMOS IC의 전기적 특성 분석

An Electrical Properties Analysis of CMOS IC by Narrow-Band High-Power Electromagnetic Wave

  • Park, Jin-Wook (Department of Electrical Engineering, Inha University) ;
  • Huh, Chang-Su (Department of Electrical Engineering, Inha University) ;
  • Seo, Chang-Su (Department of Electrical Engineering, Inha University) ;
  • Lee, Sung-Woo (Department of Electrical Engineering, Inha University)
  • 투고 : 2017.07.10
  • 심사 : 2017.07.25
  • 발행 : 2017.09.01

초록

The changes in the electrical characteristics of CMOS ICs due to coupling with a narrow-band electromagnetic wave were analyzed in this study. A magnetron (3 kW, 2.45 GHz) was used as the narrow-band electromagnetic source. The DUT was a CMOS logic IC and the gate output was in the ON state. The malfunction of the ICs was confirmed by monitoring the variation of the gate output voltage. It was observed that malfunction (self-reset) and destruction of the ICs occurred as the electric field increased. To confirm the variation of electrical characteristics of the ICs due to the narrow-band electromagnetic wave, the pin-to-pin resistances (Vcc-GND, Vcc-Input1, Input1-GND) and input capacitance of the ICs were measured. The pin-to-pin resistances and input capacitance of the ICs before exposure to the narrow-band electromagnetic waves were $8.57M{\Omega}$ (Vcc-GND), $14.14M{\Omega}$ (Vcc-Input1), $18.24M{\Omega}$ (Input1-GND), and 5 pF (input capacitance). The ICs exposed to narrow-band electromagnetic waves showed mostly similar values, but some error values were observed, such as $2.5{\Omega}$, $50M{\Omega}$, or 71 pF. This is attributed to the breakdown of the pn junction when latch-up in CMOS occurred. In order to confirm surface damage of the ICs, the epoxy molding compound was removed and then studied with an optical microscope. In general, there was severe deterioration in the PCB trace. It is considered that the current density of the trace increased due to the electromagnetic wave, resulting in the deterioration of the trace. The results of this study can be applied as basic data for the analysis of the effect of narrow-band high-power electromagnetic waves on ICs.

키워드

참고문헌

  1. M. G. Backstrom and K. G. Lovstrand, IEEE Trans. Electromagn. Compat., 46, 396 (2004). [DOI: https://doi.org/10.1109/temc.2004.831814]
  2. Electromagnetic compatibility (EMC) - Part 2-13: Environment - High-power electromagnetic (HPEM) environments - Radiated and conducted, IEC 61000-2-13, 40 (2005).
  3. J. W. Park, C. S. Huh, C. S. Seo, and S. W. Lee, J. Korean Inst. Electr. Electron. Mater. Eng., 29, 559 (2016). [DOI: https://doi.org/10.4313/JKEM.2016.29.9.559]
  4. IEC 62132-4 Ed.1: Integrated Circuits - Measurements of Electromagnetic Immunity, 150 kHz to 1 GHz - Part 4: Direct RF Power Injection Method. [DOI: https://doi.org/10.3403/30149456]
  5. M. Camp, H. Garbe, and D. Nitsch, Proc. 2002 IEEE International Symposium on Electromagnetic Compatibility (IEEE, Minneapolis, USA, 2002) p. 87. [DOI: https://doi.org/10.1109/isemc.2002.1032453]
  6. D. M. Pozar, Proc. 2012 IEEE/MTT-S International Microwave Symposium Digest (IEEE, Montreal, Canada, 2012). [DOI: https://doi.org/10.1109/mwsym.2012.6259373]
  7. D. V. Giri, High-Power Electromagnetic Radiators Nonlethal Weapons and Other Applications (Harvard University Press, United States, 2004).
  8. J. I. Hong, S. M. Hwang, and C. S. Huh, The Transactions of the Korean Institute of Electrical Engineers, 56, 1282 (2007).
  9. C. D. Taylor and D. V. Giri, High-Power Microwave Systems and Effects (Taylor & Francis, United Kingdom, 1994).
  10. O. Semenov, H. Sarbishaei, and M. Sachdev, ESD Protection Device and Circuit Design for Advanced CMOS Technologies (Springer Science & Business Media, Germany, 2008). [DOI: https://doi.org/10.1007/978-1-4020-8301-3]