DOI QR코드

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Effects of Reactive Diluents on the Electrical Insulation Breakdown Strength and Mechanical Properties in an Epoxy System

  • Park, Jae-Jun (Department of Electrical and Electronic Engineering, Joongbu University)
  • 투고 : 2013.05.19
  • 심사 : 2013.05.21
  • 발행 : 2013.08.25

초록

In order to study the effect of reactive diluents on the electrical insulation breakdown strength and mechanical properties of, a polyglycol and an aliphatic epoxy were individually introduced to an epoxy system. Reactive diluents were used in order to decrease the viscosity of the epoxy system; polyglycol acted as a flexibilizer and 1,4-butanediol diglycidyl ether (BDGE) acted as an aliphatic epoxy, which then acted as a chain extender after curing reaction. The ac electrical breakdown strength was estimated in sphere-to-sphere electrodes and the electrical breakdown strength was estimated by Weibull statistical analysis. The scale parameters of the electrical breakdown strengths for the epoxy resin, epoxy-polyglycol, and epoxy-BDGE were 45.0, 46.2, and 45.1 kV/mm, respectively. The flexural and tensile strengths for epoxy-BDGE were lower than those of the epoxy resin and those for epoxy-polyglycol were lower than those of the epoxy resin.

키워드

참고문헌

  1. J. Y. Lee, M. J. Shim and S. W. Kim, Polym. Eng. Sci., 39, 1993 (1999) [DOI: http://dx.doi.org/10.1002/pen.11592].
  2. Y. S. Cho, M. J. Shim and S. W. Kim, Mater. Chem. Phys., 66, 70 (2000) [DOI: http://dx.doi.org/10.1016/S0254-0584(00)00272-8].
  3. R. Sarathi, R. K. Sahu and P. Rajeshkumar, Mater. Sci. Eng.: A, 445, 567 (2007) [DOI: http://dx.doi.org/10.1016/j.msea.2006.09.077].
  4. P. O. Henk, T. W. Kortsen and T. Kvarts, High Perform. Polym., 11, 281 (1999) [DOI: http://dx.doi.org/10.1088/0954-0083/11/3/304].
  5. M. Ehsani, Z. Farhadinejad, S. Moemen-bellah, S. M. Bagher alavi, M. M. S. Shrazi and H. Borsi, 26th Internal Power System Conference, Tehran, Iran, 11-E-CAM-2359 (2011).
  6. C. Zilg, R. Mülhaupt, and J. Finter, Macromol. Chem. Phys., 200, 661 (1999) [DOI: http://dx.doi.org/10.1002/(SICI)1521-3935(19990301].
  7. T. Imai, F. Sawa, T. Ozaki, T. Shimizu, R. Kido, M. Kozako, and T. Tanaka, IEEE Transactions on Dielectrics and Electrical Insulation, 13, 445 (2006) [DOI: http://dx.doi.org/10.1109/TDEI.2006.1624291].
  8. J. J. Park, C. H. Lee, J. Y. Lee and H. D. Kim, IEEE Trans. Dielectr. Electr. Insul., 18, 667 (2011) [DOI: http://dx.doi.org/10.1109/TDEI.2011.5931051].