Journal of the Korean Institute of Intelligent Systems (한국지능시스템학회논문지)

Korean Institute of Intelligent Systems (한국지능시스템학회)
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Development of 3D Inspection Equipment using White Light Interferometer with Large F.O.V.

대시야 백색광 간섭계를 이용한 3차원 검사 장치 개발

  • Received : 2012.03.16
  • Accepted : 2012.12.06
  • Published : 2012.12.25
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Abstract

In this paper, semiconductor package inspection results using white light interferometer with large F.O.V., in order to apply semiconductor product inspection process, are shown. Experimental 3D data repeatability test results for the same special bumps of each substrate are shown. Experimental 3D data repeatability test results for all the bumps in each substrate are also shown. Semiconductor package inspection using white light interferometer with large F.O.V. is very important for the fast 3D data inspection in semiconductor product inspection process. This paper is surely helpful for the development of in-line type fast 3D data inspection machine.

반도체 검사 공정에 적용하기 위한 대시야 백색광간섭계(WSI ; White Light Scanning Interferometer)를 사용한 반도체 검사 결과를 본 논문에서 제시한다. 각 서브스트레이트에 있는 동일한 여러 범프에 대한 3D 데이터 반복성 측정 실험 결과를 제시한다. 각 서브스트레이트의 모든 범프에 대한 3D 데이터 반복성 측정 실험 결과를 제시한다. 반도체 검사 공정에서 3D 데이터 검사를 고속으로 달성하기 위해 대시야 백색광간섭계를 사용한 반도체 검사는 매우 중요한 의미를 갖는다. 인라인 고속 3D 데이터 검사기 개발에 본 논문이 크게 기여할 수 있다.

Keywords

Acknowledgement

Supported by : 중소기업청

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