• Title, Summary, Keyword: WSI(White Light Scanning Interferometer)

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A High-Speed White-Light Scanning Interferometer for Bump Inspection of Semiconductor Manufacture (반도체 Bump 검사를 위한 백색광 주사 간섭계의 고속화)

  • Ko, Kuk Won;Sim, Jae Hwan;Kim, Min Young
    • Journal of the Korean Society for Precision Engineering
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    • v.30 no.7
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    • pp.702-708
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    • 2013
  • The white-light scanning interferometer (WSI) is an effective optical measurement system for high-precision industries (e.g., flat-panel display and electronics packaging manufacturers) and semiconductor manufacturing industries. Its major disadvantages include a slow image-capturing speed for interferogram acquisition and a high computational cost for peak-detection on the acquired interferogram. Here, a WSI system is proposed for the semiconductor inspection process. The new imaging acquisition technique uses an 'on-the-fly' imaging system. During the vertical scanning motion of the WSI, interference fringe images are sequentially acquired at a series of pre-defined lens positions, without conventional stepwise motions. To reduce the calculation time, a parallel computing method is used to link multiple personal computers (PCs). Experiments were performed to evaluate the proposed high-speed WSI system.

Optical Probe of white Light Interferometry for Precision Coordinate Metrology (정밀 삼차원 측정을 위한 백색광 간섭 광학 프로브 개발)

  • 김승우;진종한;강민구
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • pp.195-198
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    • 2002
  • Demand for high precision measurement of large area is increasing in many industrial fields. White-light Scanning Interferometer(WSI) is a well-known method for 3D profile measurement. However WSI has some limitations in a measurement range because of the sensing mechanism. Therefore, in this paper we use a heterodyne laser interferometer to get over the limitations of a short measurement range in WSI, We suggest a new WSI system combined with heterodyne laser interferometer. This system is aimed at eliminating Abbe error with measuring the focus point directly. With the use of triggering functionality of WSI, we can use this system as a probe of a precision stage such as a probe of CMM. The suggested system gives a repeatability of 87 nm in the absolute distance measurement test under the laboratory environment.

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Development of 3D Inspection Equipment using White Light Interferometer with Large F.O.V. (대시야 백색광 간섭계를 이용한 3차원 검사 장치 개발)

  • Koo, Young Mo;Lee, Kyu Ho
    • Journal of the Korean Institute of Intelligent Systems
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    • v.22 no.6
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    • pp.694-699
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    • 2012
  • In this paper, semiconductor package inspection results using white light interferometer with large F.O.V., in order to apply semiconductor product inspection process, are shown. Experimental 3D data repeatability test results for the same special bumps of each substrate are shown. Experimental 3D data repeatability test results for all the bumps in each substrate are also shown. Semiconductor package inspection using white light interferometer with large F.O.V. is very important for the fast 3D data inspection in semiconductor product inspection process. This paper is surely helpful for the development of in-line type fast 3D data inspection machine.

Flip Chip Bump 3D Inspection Equipment using White Light Interferometer with Large F.O.V. (대시야 백색광 간섭계를 이용한 Flip Chip Bump 3차원 검사 장치)

  • Koo, Young Mo;Lee, Kyu Ho
    • Journal of the Korean Institute of Intelligent Systems
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    • v.23 no.4
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    • pp.286-291
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    • 2013
  • In this paper, in-line type flip chip bump 3D inspection equipment, using white light interferometer with large F.O.V., which is aimed to be used in flip chip bump test process is developed. Results of flip chip bump height measurement in many substrates and repeatability test results for the bumps in fixed location of each substrate are shown. Test results from test bench and those from developed flip chip bump 3D inspection equipment are compared and as a result repeatability is improved by reducing the impact of system vibration. A valuation basis for the testing quality of flip chip bump 3D inspection equipment is proposed.

Development of Elimination Method of Measurement noise to Improve accuracy for White Light Interferometry (백색광 간섭계의 정밀도 향상을 위한 노이즈 제거 방법)

  • Ko, Kuk-Won;Cho, Soo-Yong;Kim, Min-Young
    • Journal of Institute of Control, Robotics and Systems
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    • v.14 no.6
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    • pp.519-522
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    • 2008
  • As industry of a semiconductor and LCD industry have been rapidly growing, precision technologies of machining such as etching and 3D measurement are required. Stylus has been important measuring method in traditional manufacturing process. However, its disadvantages are low measuring speed and damage possibility at contacting point. To overcome mentioned disadvantage, non-contacting measurement method is needed such as PMP(Phase Measuring Profilometry), WSI(white scanning interferometer) and Confocal Profilometry. Among above 3 well-known methods, WSI started to be applied to FPD(flat panel display) manufacturing process. Even though it overcomes 21t ambiguity of PMP method and can measure objects which has specular surface, the measuring speed and vibration coming from manufacturing machine are one of main issue to apply full automatic total inspection. In this study, We develop high speed WSI system and algorithm to reduce unknown noise. The developing WSI and algorithm are implemented to measure 3D surface of wafer. Experimental results revealed that the proposed system and algorithm are able to measure 3D surface profile of wafer with a good precision and high speed.

Robust Matching Algorithm for Optical Images (광학 영상의 강인한 정합 알고리즘)

  • Yang, Han-Jin;Joo, Young-Hoon
    • Journal of Institute of Control, Robotics and Systems
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    • v.17 no.3
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    • pp.248-253
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    • 2011
  • This paper proposes the robust matching algorithm for optical images obtained by WSI(White-light Scanning Interferometer) machine. The matching algorithms are divided by two part according to the matching points: algorithm whether the matching points between two images exist or not. Also, after matching the images, we propose the algorithm to smooth the matched image. Finally, we show the effectiveness and feasibility of the proposed method through some experiments.