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Characterization of Surface Textured Silicon Substrates by SF6/O2 Gas Mixture

SF6/O2 혼합가스에 의한 실리콘 웨이퍼의 표면 텍스쳐링 특성

  • Kang, Min-Seok (Department of Electronic Materials Engineering, Kwangwoon University) ;
  • Joo, Sung-Jae (Electrotechnology Research Institute, Power Semiconductor Research Group) ;
  • Koo, Sang-Mo (Department of Electronic Materials Engineering, Kwangwoon University)
  • 강민석 (광운대학교 전자재료공학과) ;
  • 주성재 (한국전기연구원 에너지반도체연구센터) ;
  • 구상모 (광운대학교 전자재료공학과)
  • Received : 2012.03.23
  • Accepted : 2012.04.05
  • Published : 2012.05.01

Abstract

The optical losses associated with the reflectance of incident radiation are among the most important factors limiting the efficiency of a solar cell. Therefore, photovoltaic cells normally require special surface structures or materials, which can reduce reflectance. In this study, nano-scale textured structures with anti-reflection properties were successfully formed on silicon. The surface of sicon wafer was etched by the inductively coupled plasma process using the gaseous mixture of $SF_6+O_2$. We demonstrate that the reflection characteristic has significantly reduced by ~0% compared with the flat surface. As a result, the power efficiency $P_{max}$ of the nano-scale textured silicon solar cell were enhanced up to 20%, which can be ascribed primarily to the improved light trapping in the proposed nano-scale texturing.

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References

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