Journal of electromagnetic engineering and science

  • 제11권1호
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  • Pages.62-69
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  • 2011
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  • 2671-7255(pISSN)
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  • 2671-7263(eISSN)
한국전자파학회 (The Korean Institute of Electromagnetic Engineering and Science)
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Electrical Parameter Extraction of High Performance Package Using PEEC Method

  • Pu, Bo (Department of Electrical and Electronics Engineering, Sungkyunkwan University) ;
  • Lee, Jung-Sang (Department of Electrical and Electronics Engineering, Sungkyunkwan University) ;
  • Nah, Wan-Soo (Department of Electrical and Electronics Engineering, Sungkyunkwan University)
  • 투고 : 2010.11.26
  • 심사 : 2011.03.07
  • 발행 : 2011.03.31
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초록

This paper proposes a novel electrical characterization approach for a high-performance package system using an improved Partial Element Equivalent Circuit (PEEC). As the effect of interconnects becomes a pivotal factor for the performance of high-speed electronic systems, there is a great demand for an accurate equivalent model for interconnects. In particular, an equivalent model of interconnects is established in this paper for the Fine-Pitch Ball Grid Array (FBGA) package using the improved PEEC method. Based on the equivalent model, electrical characteristics are analyzed; furthermore, these are verified through the measurement results of a Vector Network Analyzer (VNA).

키워드

참고문헌

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