• Carbon letters
• /
• v.13 no.1
• /
• pp.23-28
• /
• 2012

Graphene is an attractive material for device applications, but device characteristics are very unstable because the graphene is very sensitive to environmental factors such as charges nearby the graphene, metal contacts, defects, contaminants and other adsorbates. Since the interactions between graphene and environmental factors affect the electrical characteristics of graphene devices, the interpretation of electrical characteristics as simple as current-voltage curves is non-trivial, despite the common practice of using well known electrical characterization methods that have been used in silicon MOSFET. This paper addresses major obstacles in the electrical characterization of graphene devices and offers countermeasures to improve the accuracy of electrical characterization methods.

• Journal of the Institute of Electronics Engineers of Korea SD
• /
• v.42 no.4 s.334
• /
• pp.45-52
• /
• 2005

This paper presents the characterization of through hole vias on printed circuit board (PCB) through the time domain and frequency domain measurements. The time domain measurement was performed on a single via using the TDR, and the model parameters were extracted by the fitting simulation using HSPICE. The frequency domain measurement was also performed by using 2 port VNA, and the model parameters were extracted by fitting simulation with ADS. Using the ABCD matrices, the do-embedding equations were derived probing in the same plane in the VNA measurement. Based on the single via characterization, the differential via characterization was also performed by using TDR measurements. The time domain measurements were performed by using the odd mode and even mode sources in TDR module, and the Parameter values were extracted by fitting with HSPICE. Comparing measurements with simulations, the maximum calculated differences were $14\%$ for single vias and $17\%$ for differential vias.

• Ceramist
• /
• v.22 no.4
• /
• pp.332-349
• /
• 2019

Ceramic thin films are key materials for fundamental electronic devices such as transistors and capacitors which are highly important for the state-of-the-art electronic products. Their characteristic dielectric properties enable accurate control of current conduction through channel of transistors and stored charges in capacitor electrodes. The electronic conduction in ceramic thin films is one of the most important part to understand the electrical properties of electronic device based on ceramic thin films. There have been numerous papers dealing with the electronic conduction mechanisms in emerging ceramic thin films for future electronic devices, but these studies have been rarely reviewed. Another interesting electrical characterization technique is one based on electrical pulses and following transient responses, which can be used to examine physical and chemical changes in ceramic thin films. In this review, studies on various conduction mechanisms through ceramic thin films and electrical characterization based on electric pulses are comprehensively reviewed.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 1998.11a
• /
• pp.81-84
• /
• 1998

New diagnostic techniques have been tried on the applications of chemical, physical and micro-structural methods because there was a limit to diagnose degradation in Korean Underground Residential Distribution (URD) power cables with the conventional electrical methods. In this study, non-electrical properties were carried out as such. Characterization of interface layer was analyzed by X-ray, characterization of insulator by water tree, degree of crosslinking, shrinkage as well as ${\mu}$ -FTIR, characterization of semiconductive layer by volume resistivity. Electrical properties were also performed by leakage current.

• Proceedings of the KIEE Conference
• /
• 2000.11d
• /
• pp.857-859
• /
• 2000

A planar MEA(Multi-channel Electrode Array) has been developed for monitoring the electrical activity of electrogenic cells in a cell culture by an extracellular recording. The material, fabrication process, characterization of the array, cleaning effect and impedance according to opening size by impedance measurement are described.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.13 no.10
• /
• pp.847-858
• /
• 2000

The aging characteristics of 2 kinds of 3 years field-aged distribution polymer insulators which were dismounted from 5 regions have been investigated by electrical test and material characterization. Although the tan $\delta$of specimens prepared from weathershed was increased with surface aging, the tan $\delta$and leakage current of real products had no difference between virgin and dismounted ones. Due to the aging, all dismounted polymer insulators had micro-cracks on the surface of weathershed and only the products of manufacturer B showed the reduction of OIT(oxidation induction time). But, there were no differences between virgin and dismounted products in contact angle and chemical structure. Therefore, it can be considered that the aging is only limited on the surface of dismounted polymer insulators and that NMR technique are very useful to evaluate the aging of polymer materials.

• Bulletin of the Korean Chemical Society
• /
• v.26 no.5
• /
• pp.697-706
• /
• 2005

We review the evolution of electrochemical studies of conducting polymers into the current state-of-the-art based primarily on our work. While conventional electrochemical experiments sufficed for the needs in the phase of studies of both electrochemical synthesis and characterization of conducting polymers, developments of various new experimental techniques have led to their introduction to this field for more refined information. As a result, the conventional electrochemical, spectroelectrochemical, electrochemical quartz crystal microbalance, impedance, and morphological as well as electrical characterization studies all made important contributions to a better understanding of the polymerization mechanisms and the conductive properties of these classes of polymers. From this review, we hereby expect that the electrochemical techniques will continue to play important roles in bringing this field to the practical applications such as nanoscale electronic devices.

• Transactions on Electrical and Electronic Materials
• /
• v.13 no.2
• /
• pp.69-72
• /
• 2012

In this study, deposition of low-dielectric constant SiOC(H) films by conventional plasma-enhanced chemical vapor deposition (PECVD) were investigated through various characterization techniques. The results show that, with an increase in the plasma power density, the relative dielectric constant (k) of the deposited films decreases whereas the refractive index increases. This is mainly due to the incorporation of organic molecules with $CH_3$ group into the Si-O-Si cage structure. It is as confirmed by FT-IR measurements in which the absorption peak at 1,129 $cm^{-1}$ corresponding to Si-O-Si cage structure increases with power plasma density. Electrical characterization reveals that even after fast thermal annealing process, the leakage current density of the deposited films is in the order of $10^{-11}$ A/cm at 1.5 MV/cm. The reliability of the SiOC(H) film is also further characterized by using BTS test.

• Journal of electromagnetic engineering and science
• /
• v.11 no.1
• /
• pp.62-69
• /
• 2011

This paper proposes a novel electrical characterization approach for a high-performance package system using an improved Partial Element Equivalent Circuit (PEEC). As the effect of interconnects becomes a pivotal factor for the performance of high-speed electronic systems, there is a great demand for an accurate equivalent model for interconnects. In particular, an equivalent model of interconnects is established in this paper for the Fine-Pitch Ball Grid Array (FBGA) package using the improved PEEC method. Based on the equivalent model, electrical characteristics are analyzed; furthermore, these are verified through the measurement results of a Vector Network Analyzer (VNA).

• Journal of Electrical Engineering and Technology
• /
• v.12 no.1
• /
• pp.443-450
• /
• 2017

Nowadays, Power Line Communication (PLC) is gaining high attention from industry and electric supply companies for the services like demand response, demand side management and Advanced Metering Infrastructure (AMI). The reliable services to consumers using PLC can be provided by utilizing an efficient PLC channel for which sophisticated channel modeling is very important. This paper presents characterization of a Low Voltage (LV) access network for Narrowband Power Line Communications (NB-PLC) using transmission line (TL) theory and a Simulink model. The TL theory analysis not only includes the constant parameters but frequency selectivity is also introduced in these parameters such as resistance, conductance and impedances. However, the proposed Simulink channel model offers an analysis and characterization of capacitive coupler, network impedance and channel transfer function for NB-PLC. Analysis of analytical and simulated results shows a close agreement of the channel transfer function. In the absence of a standardized NBPLC channel model, this research work can prove significant in improving the efficiency and accuracy of NB-PLC communication transceivers for Smart Grid communications.