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Microstructure and Strength of the Microjoined Electrode for the Lamp of the LCD Backlight Unit

TFT-LCD 백라이트 유닛(BLU) 램프용 전극 미세 접합부의 강도 및 미세조직

  • Kim, Gwang-Soo (Soonchunhyang University Department of Display Materials Engineering) ;
  • Kim, Sang-Duck (Soonchunhyang University Department of Display Materials Engineering)
  • 김광수 (순천향대학교 디스플레이 신소재공학과) ;
  • 김상덕 (순천향대학교 디스플레이 신소재공학과)
  • Published : 2009.01.31

Abstract

TFT-LCD is the most popular type of flat display panel in the information technology field. The back light unit is a main part of the structure of a TFT-LCD panel. Occasionally, studies have shown that failures of the CCFL of the BLU occur due to the poor weld characteristics of these materials. The aim of this study was to prepare some technical data and to characterize a microjoined electrode for the CCFL. Microstructure examinations, microhardness measurements, resistance measurements and microtensile tests of the microjoined electrode were carried out. The result indicates that a large amount of grain coarsening exists in the heat-affected zone (HAZ) of the weld between the cup and the pin. This grain coarsening of the HAZ between the cup and pin is caused by the welding cycle, which may have an influence on the lowest microhardness values. Fracturing of the microjoined electrode also occurred at the HAZ close to the cup between the weld holding the cup and the pin. Additionally, no specific changes of the electrical resistance among the cup, pin, and lead wire themselves or in the microjoined electrode were observed.

Keywords

References

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