• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.441-443
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• 2005

According as CCFL(Cold Cathode Fluorescent lamp) of light source in Backlight unit for Note PC (Personal computer) is presently needed to low power consumption and long life time, the development focus of CCFL is going on the discharge gas, phosphor and electrode material. First of all, discharge voltage characteristic of CCFL is closely connected with electrode material For low discharge voltage, the characteristic of electrode material is needed to low work function, low sputtering ratio and superior manufacturing property. We developed new CCFL with Nb/Ni Clad electrode superior to conventional CCFL. Because Nb/Ni Clad electrode with Ni material and Nb material, the electrical characteristic is superior to other electrode materials. The electrode of Nb/Ni Clad is composed that Ni of outside material has superior manufacturing property and Nb of inside material has low work function. Nb/Ni Clad of new electrode material is made by process of Rolling mill at high pressure and heat treatment. We compared electrical characteristic of Nb/Ni clad electrode with conventional Mo electrode by measurement. Mo electrode and Nb/Ni Clad electrode of cup type with diameter 1.1 mm and length 3.0mm are used to this experiment. Material content of Mo electrode is Mo 100%. But, Nb/Ni Clad electrode is composed by content of Nb 40% and Ni 60%. The result of comparison measurement between new CCFL with Nb/Ni Clad electrode and conventional CCFL was appeared that CCFL with Nb/Ni Clad electrode had superior characteristic than conventional CCFL. As a result of experiment, we completed Note PC with low power consumption and long life time by application of new CCFL with Nb/Ni Clad electrode.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.3
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• pp.1308-1312
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• 2011

CCFL(Cold Cathode Fluorescent Lamp)for BLU of LCD and special lighting has been widely utilized. The removal of oxide film formed on electrode of CCFL in manufacturing process is required. In this pape Plasma treatment was carried out to remove the oxide film. To ensure the optimum process, the analysis of sheet resistance, XRD, AFM and solder test was conducted. A minimum sheet resistance and the maximum percentage of the solder coverage ratio were measured in optimal process conditions such as plasma power consumption 600W and processing time of 70 seconds. As the plasma treatment is confirmed to be due to removal of copper oxide, this process is expected to be used as a treatment of electrode for CCFL.

• Journal of Welding and Joining
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• v.27 no.4
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• pp.73-78
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• 2009

Characterization of the microweld CCFL electrode for the TFT-LCD backlight unit was carried out in terms of the glass beading heat treatment conditions. We evaluate the weld zone and parent metal of the microweld CCFL electrodes that were exposed to simulated glass beading heat treatment. The CCFL electrode was composed of the cup made with pure Ni, the pin made with pure Mo and the lead wire made with Ni-Mn alloy. Each part of the electrode was assembled together by micro spot welding process and then the assembled electrodes were exposed to simulated glass beading temperatures of $700^{\circ}C,\;750^{\circ}C$ and $800^{\circ}C$. The microstructures of the microweld CCFL electrode were observed by using optical microscope, scanning electron microscope and EDS. Micro-tensile and microhardness test were also carried out. The results indicated that the grain coarsening in the HAZs(heat affected zones) for both the cup-pin weld and pin-lead wire were exhibited and the grain coarsening of the HAZ for the cup and the lead wire was more obvious than the HAZ of the pin. The micro-tensile test revealed that the fracture occurred at the cup-pin weld zone for all test conditions. The fracture surface could be classified into two parts such as pin portion and cup portion including weld nugget. The failure was seemed to be initiated from the boundary between nugget and pin through the weld joint. The result of the microhardness measurement exhibited that the relatively low hardness value, about 105HV was recorded at the HAZ of the cup. This value was about 50% less than that of the original value of the cup. The reduction of the microhardness was considered as the cause of the grain coarsening due to welding process. It was also appeared that there was no change in electric resistance for the standard electrodes and heat treated electrodes.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.39 no.12
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• pp.1016-1021
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• 2002

Luminescent characteristics of FLs were studied according to the structure of electrode for LCD backlight applications. The luminance and luminous efficiency of the FLs fabricated under same conditions were measured and evaluated as functions of magnitude of applied voltage and widths of external electrode. The luminance and luminous efficiency of CCFL at 12 V were 27600 cd/$m^2$ and 35.3 lm/w, respectively The luminance of EEFLS increased as the widths of external electrode increased, and the luminous efficiency of EEFLS showed to increase to 20 mm of electrode width) and to decrease at wider than 20 m of electrode widths. The luminance and luminous efficiency of EEFL with 20 mm of electrode widths were 21600 cd/$m^2$ and 26500 cd/$m^2$, 35.6 lm/w and 34.8 lm/w at 12 V, 14 V, respectively.

• Journal of the Korea Convergence Society
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• v.11 no.11
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• pp.183-187
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• 2020

The molybdenum cup and molybdenum pin, which are the main materials of the molybdenum electrode used for the LCD BLU CCFL electrode, have not been developed in Japan and all of them are imported and used from Japan, is giving a competitive burden. In this research, to develop the manufacturing technology of molybdenum pin used for CCFL electrode of LCD BLU, development of linear processing technology, development of molybdenum wire surface treatment technology, development of wire cutting technology, production of molybdenum pin, design and fabrication of JIG and Fixture for inspection, molybdenum pin prototyping and analysis, and development of 100% molybdenum pin inspection technology. In this paper, especially, In this paper, especially, research on the convergency design for total inspection machine is treated. is treated.

• Transactions on Electrical and Electronic Materials
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• v.8 no.6
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• pp.268-273
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• 2007

In this study, It was studied about the luminance characteristics of 17 inch direct-type back light using EEFL(external electrode fluorescent lamp) and CCFL(cold cathode fluorescent lamp). The EEFL has a long life time because the electrode is installed outside of lamp. And it is produced in lower price than conventional CCFL. Moreover, it does not need process of installing internal electrode. However, the EEFL technology has several problems such as difficulty of designing driving inverter and preventing this phenomenon along the skin of lamps. We suggested two types of backlight unit for LCD TV application using the EEFL and the CCFL. We found optimized optical design parameters. We set the optical variation parameters such as lamp height, lamp distance, total thickness, and angles of inner walls. We achieved 7580 nits of center luminance, 82% of luminance uniformity by using 20 lamps of the EEFL and 7297 nits of center luminance, 78% of luminance uniformity by using 16 lamps of the CCFL.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.428-428
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• 2007

In this study, It was studied about the luminance characteristics of 17inch direct-type back light using EEFL(External Electrode Fluorescent Lamp). EEFI has a long life time because the electrode is installed outside of lamp. And it is produced low price than conventional CCFL. It does not need process of installing internal electrode. But EEFL technology has several problems such as difficulty of design driving inverter, and prevents leckage current along the skin of lamps. Therefore, by the optimizing of inverter properties, 7525 nit center luminance was acquired in almost same power consumption condition. It was almost same luminance in CCFL backlight unit. And it was operated stably in low operating temperature such as the value of $40^{\circ}C$, so that it was adopted in conventional LCD-TV application.

• Journal of the Korea Convergence Society
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• v.11 no.6
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• pp.197-201
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• 2020

The molybdenum cup and molybdenum pin, which are the main materials of the molybdenum electrode used for the LCD BLU CCFL electrode, did not been developed in Japan and all of them are imported and used from Japan, is giving a competitive burden. In this research, to develop the manufacturing technology of molybdenum pin used for CCFL electrode of LCD BLU, development of linear processing technology, development of molybdenum wire surface treatment technology, development of wire cutting technology, production of molybdenum pin, design and fabrication of JIG and Fixture for inspection, molybdenum pin prototyping and analysis, and development of 100% molybdenum pin inspection technology. In this paper, especially, research on design and manufacturing of JIG and Fixture for molybdenum pin manufacturing and inspection is treated.

• Korean Journal of Materials Research
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• v.19 no.1
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• pp.7-12
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• 2009

TFT-LCD is the most popular type of flat display panel in the information technology field. The back light unit is a main part of the structure of a TFT-LCD panel. Occasionally, studies have shown that failures of the CCFL of the BLU occur due to the poor weld characteristics of these materials. The aim of this study was to prepare some technical data and to characterize a microjoined electrode for the CCFL. Microstructure examinations, microhardness measurements, resistance measurements and microtensile tests of the microjoined electrode were carried out. The result indicates that a large amount of grain coarsening exists in the heat-affected zone (HAZ) of the weld between the cup and the pin. This grain coarsening of the HAZ between the cup and pin is caused by the welding cycle, which may have an influence on the lowest microhardness values. Fracturing of the microjoined electrode also occurred at the HAZ close to the cup between the weld holding the cup and the pin. Additionally, no specific changes of the electrical resistance among the cup, pin, and lead wire themselves or in the microjoined electrode were observed.

• Proceedings of the KWS Conference
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• 2007.11a
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• pp.238-240
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• 2007