Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)
- Volume 14 Issue 3
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- Pages.65-71
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- 2007
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- 1226-9360(pISSN)
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- 2287-7525(eISSN)
Cu Via-Filling Characteristics with Rotating-Speed Variation of the Rotating Disc Electrode for Chip-stack-package Applications
칩 스택 패키지에 적용을 위한 Rotating Disc Electrode의 회전속도에 따른 Cu Via Filling 특성 분석
- Lee, Kwang-Yong (IPT Team, Samsung Electronics) ;
- Oh, Tae-Sung (Department of Materials Science and Engineering, Hongik University)
- Published : 2007.09.30
Abstract
For chip-stack package applications, Cu filling characteristics into trench vias of
칩 스택 패키지에 적용을 위해 폭