마이크로전자및패키징학회지 (Journal of the Microelectronics and Packaging Society)
- 제13권4호
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- Pages.37-43
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- 2006
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- 1226-9360(pISSN)
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- 2287-7525(eISSN)
Electrodeposition 변수에 따른 Sn 도금의 표면 거칠기와 플립칩 접속된 Sn 범프의 접속저항
Surface Roughness of the Electroplated Sn with Variations of Electrodeposition Parameters and Contact Resistance of the Flip-chip-bonded Sn Bumps
- Jung, Boo-Yang (Department of Materials Science and Engineering, Hongik University) ;
- Park, Sun-Hee (Department of Materials Science and Engineering, Hongik University) ;
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Kim, Young-Ho
(Division of Materials Science and Engineering, Hanyang University) ;
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Oh, Tae-Sung
(Department of Materials Science and Engineering, Hongik University)
- 발행 : 2006.12.30
초록
플립칩 공정에 Sn 범프를 적용하기 위해 도금전류밀도와 전류모드에 따른 Sn 도금막의 표면 거칠기와 경도를 측정하였다. 전류밀도
Surface roughness and hardness of the electroplated Sn were characterized with variations of electroplating current density and current mode. The Sn electroplated at