References
- S. H Kim, D. W. Lee and K. H. Chung, Kor. J. Mater. Res., 9, 65 (1999)
- M. M. D. Ramos, A. M. Stoncham and A. P. Sutton, Acta metall. mater, 41, 2105 (1993)
- R. R. Tummala and E. J. Rymaszewski, Microelectronics Packaging Handbook, Van Nostrand Reinhold, New York, (1989)
- A. P. Payne and B. M. Clemens, J. Mater. Res., 7, 1370 (1992) https://doi.org/10.1557/JMR.1992.1370
- A. G Dirks and J. J. van den Broek, J. Vac. Sci. Technol., A3, 2618 (1985) https://doi.org/10.1116/1.572799
- C. J. Wang, C. A. Chang, C. E. Farrel and A. G Schrott, Appl, Phys. Lett., 62, 654 (1993) https://doi.org/10.1063/1.108888
- J. Kim, S. H. Wen and D. Yee, J. Vac. Sci. Technol., A6, 2366 (1988) https://doi.org/10.1116/1.575557
- T. X. Liang, Y. Q. Liu, Z. Q. Fu, Z. Q. Luo and K. Y. Zhang, This Solid films, 473, 247 (2005) https://doi.org/10.1016/j.tsf.2004.07.073
- C. H. Yang, S. C. Lee, J, M. Wu and T. C. Lin, Appl, Surface Sci., 252, 1818 (2005) https://doi.org/10.1016/j.apsusc.2005.03.182
- J. L. Vossen and Werner Kern, Thin film process Academc press, New York, San Francisco, London (1978)
- M. L. Sartorelli, A. Q. Schervenski, R. G. Delatorre and P. Klauss, Phys. stat. sol, 187, 91 (2001) https://doi.org/10.1002/1521-396X(200109)187:1<91::AID-PSSA91>3.0.CO;2-9
- R. Haight, R. C. White, B. D. Silverman and P. S. Ho, J. Vac. Sci. Technol., A, Vac. Surf. Films, 6, 2188 (1988) https://doi.org/10.1116/1.575010
- D. S. Dunn and J. L. Grant, J. Vac. Sci. Technol., A, Vac. Surf. Films, 7, 253 (1989) https://doi.org/10.1116/1.576128
- S. H. Kim, S. W. Na, N. E. Lee, Y. W. Nam and Y. H. Kim, Surf. Coat. Technol., 200, 2072 (2005) https://doi.org/10.1016/j.surfcoat.2005.05.021
- H. S. Lee, H. S. Kim and C. M. Lee, J. Kor. Inst. Met. & Mater., 39, 920 (2001)
- T. Fukada, M. Hasegawa, Y. Toyda, K. Sato, M. Nunoshita and H. Kotani, Ext. Abs. 53rd Autumn Meeting, Jpn. Soc. Appl, Phys., 18p-ZR-3 (1992)
- J. Li. Y. Shacham-Diamond, J. W. Mayer and E. G. Colgan, Proc. VMIC Coference, 153 (1991) https://doi.org/10.1109/VMIC.1991.152979
- H. J. Lee. Ph.D. Thesis, P. 4, Seoul National University, Seoul (2003)
- H. J. Kang, P. N. Park, S. J. Park and S. Y. Choi, Electro. Technol. Res., 203, 8 (2003)
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