Journal of the Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회논문지)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
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Simulation of Ultrasonic Dry Cleaning for Semiconductor/display Device Application

반도체/디스플레이 소자용 초음파 건식세정 시뮬레이션 연구

  • Published : 2004.12.01
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Abstract

In this paper, the optimum design of ultrasonic dry cleaning head was investigated. The transducer instead of mechanical dynamic structure was used to generate ultrasonic wave and the horn-shape amplifier was utilized to solve the energy decaying problem of ultrasonic wave with propagating it through the media. The analyses of ultrasonic wave and a fluid for the selected structure of a cleaning head were carried out using SYSNOISE and ANSYS simulators, respectively. Based on simulator results, the distance between a horn and the substrate of 4 mm and the horn diameter of 10 mm were determined to maximize the energy of ultrasonic waves. The cooling structure was also considered to reduce the heat from the transducer and the horn. The equivalent circuit for the fabricated horn was deduced from HP4194A impedance/gain/phase analyzer and the frequency of an ultrasonic wave of 20.25 kHz was confirmed using the parameters of the equivalent circuit.

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References

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