대한전기학회논문지:전기물성ㆍ응용부문C (The Transactions of the Korean Institute of Electrical Engineers C)

대한전기학회 (The Korean Institute of Electrical Engineers)
권호 표지

비정질 실리콘 박막을 이용한 Sodalime-Sodalime 정전 열 접합 및 FEA Packaging 응용

Sodalime-sodalime Electrostatic Bonding using Amorphous Silicon Interlayer and Its Application to FEA Packging

  • 발행 : 1999.09.01
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초록

As a fundamental study for FED tubeless packaging, sodalime-sodalime electrostatic bonding was performed by using on the developed bonding mechanism. Thebonding properties of the bonded sodalime-sodalime structure were investigated through SEM and SIMS analyses. Mo-tip FEA was vacuum-packaged by the developed bonding process and the packaged device generated the field emission current.

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참고문헌

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