Proceedings of the KWS Conference (대한용접접합학회:학술대회논문집)

The Korean Welding and Joining Society (대한용접접합학회)
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Influence of Thermal Aging at the Interface Cu/sn-Ag-Cu Solder Bump Made by Electroplating

전해도금에 의해 형성된 Sn-Ag-Cu 솔더범프와 Cu 계면에서의 열 시효의 영향

  • 이세형 (한국생산기술연구원 생산기반기술본부 정밀접합팀, 마이크로조이닝센터) ;
  • 신의선 (한국생산기술연구원 생산기반기술본부 정밀접합팀, 마이크로조이닝센터) ;
  • 이창우 (한국생산기술연구원 생산기반기술본부 정밀접합팀, 마이크로조이닝센터) ;
  • 김준기 (한국생산기술연구원 생산기반기술본부 정밀접합팀, 마이크로조이닝센터) ;
  • 김정한 (한국생산기술연구원 생산기반기술본부 정밀접합팀, 마이크로조이닝센터)
  • Published : 2007.11.15
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Abstract

In this paper, fabrication of Sn-3.0Ag-0.5Cu solder bumping having accurate composition and behavior of intermetallic compounds(IMCs) growth at interface between Sn-Ag-Cu bumps and Cu substrate were studied. The ternary alloy of the Sn-3.0Ag-0.5Cu solder was made by two binary(Sn-Cu, Sn-Ag) electroplating on Cu pad. For the manufacturing of the micro-bumps, photo-lithography and reflow process were carried out. After reflow process, the micro-bumps were aged at $150^{\circ}C$ during 1 hr to 500 hrs to observe behavior of IMCs growth at interface. As a different of Cu contents(0.5 or 2wt%) at Sn-Cu layer, behavior of IMCs was estimated. The interface were observed by FE-SEM and TEM for estimating of their each IMCs volume ratio and crystallographic-structure, respectively. From the results, it was found that the thickness of $Cu_3Sn$ layer formed at Sn-2.0Cu was thinner than the thickness of that layer be formed Sn-0.5Cu. After aging treatment $Cu_3Sn$ was formed at Sn-0.5Cu layer far thinner.

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