Evaluation of Risk rates for Foreign Materials in a Minienvironment

클린룸 국소환경에서 이물의 위험율 평가

  • Noh, Kwang-Chul (School of Mechanical Engineering, Yonsei University) ;
  • Oh, Myung-Do (Department of Mechanical and Information Engineering, University of Seoul)
  • 노광철 (연세대학교 기계정보공학부) ;
  • 오명도 (서울시립대학교 기계정보공학과)
  • Published : 2007.11.30

Abstract

In this study, the risk rates of different contamination sources of the Foreign material in a minienvironment were analyzed through CFD simulation. From the results, the ambient contamination sources mainly affect wafers in the FOUP, whereas the internal contamination sources mainly affect wafers laid on the robot arm in the minienvironment. And the purging plenum system is very useful in protecting the wafers in the FOUP from Foreign materials transferred from the FFU. However, this system is unable to protect the wafers on the robot arm from internal Foreign materials and the wafers in the FOUP from sources of the interface between the FOUP and the minienvironment.

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