한국전기전자재료학회:학술대회논문집 (Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference)

한국전기전자재료학회 (The Korean Institute of Electrical and Electronic Material Engineers)
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PCB일괄적층에 관한 특허동향분석

Patent Trend Report for PCB Parallel Build-up

  • 정인성 (한국특허정보원, 조사분석4팀) ;
  • 이영욱 (한국특허정보원, 조사분석4팀)
  • Jeong, In-Seong (Korea Institute of Patent Information, Search & Analysis Team 4) ;
  • Lee, Young-Uk (Korea Institute of Patent Information, Search & Analysis Team 4)
  • 발행 : 2006.06.22
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초록

Application of the parallel Build-up is increasing continuously. This report presents about the PCB Build-up technology since 2000. Among the parallel build-up technologies, PALAP application - after making the via, filling the via with electric conductive paste, then expose to make wiring pattern and put them by layer without any glue or middle - is actively developing, especially DENSO company.

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