Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
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Improvement of Mixed Abrasive Slurry (MAS) Characteristics According to the Abrasive Adding

연마제 첨가량에 따른 Mixed Abrasive Slurry (MAS)의 CMP 특성 고찰

  • 이성일 (대불대학교 전기전자공학과) ;
  • 이영균 (대불대학교 전기전자공학과) ;
  • 박성우 (대불대학교 전기전자공학과) ;
  • 이우선 (조선대학교 전기공학과) ;
  • 서용진 (대불대학교 전기전자공학과)
  • Published : 2006.11.09
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Abstract

Chemical mechanical polishing (CMP) technology has been widely used for global planarization of multi-level interconnection for ULSI applications. However, the cost of ownership and cost of consumables are relatively high because of expensive slurry. In this paper, we studied the mixed abrasive slurry (MAS). In order to save the costs of slurry, the original silica slurry was diluted by de-ionized water (DIW). And then, $ZrO_2$, $CeO_2$, and $MnO_2$ abrasives were added in the diluted slurry in order to promote the mechanical force of diluted slurry. We have also investigate the possibility of mixed abrasive slurry for the oxide CMP application.

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