Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
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Effect of Corrosion inhibitor, Benzotriazole (BTA), on Particle Adhesion in Cu CMP

Cu CMP중 BTA에 의한 Particle의 흡착에 관한 연구

  • Song, Jae-Hoon (Division of Materials and Chemical Engineering, Hanyang University) ;
  • Hong, Yi-Koan (Division of Materials and Chemical Engineering, Hanyang University) ;
  • Kim, Tae-Gon (Division of Materials and Chemical Engineering, Hanyang University) ;
  • Park, Jin-Goo (Division of Materials and Chemical Engineering, Hanyang University)
  • 송재훈 (한양대학교 재료화학공학부) ;
  • 홍의관 (한양대학교 재료화학공학부) ;
  • 김태곤 (한양대학교 재료화학공학부) ;
  • 박진구 (한양대학교 재료화학공학부)
  • Published : 2005.11.10
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Abstract

The effect of benzotriazole (BTA) on the adhesion force of silica and pad particle on Cu/TEOS wafer surfaces was investigated with and without the addition of BTA. Cu-BTA had the isoelectric point (IEP) at around pH 4$\sim$8. Pad particles were more positive zeta potentials than silica. The adhesion force initially decreased of silica and pad particle on Cu surfaces when BTA was added. However, the more BTA was added, the more adhesion force gradually increased with the increase of BTA concentrations. Then the adhesion force of pad particle was higher than silica. And TEOS didn't resulted increasing adhesion force like Cu when BTA was added in DI water.

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