Proceedings of the KIEE Conference (대한전기학회:학술대회논문집)

The Korean Institute of Electrical Engineers (대한전기학회)
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LTCC-based Packaging Method using Au/Sn Eutectic Bonding for RF MEMS Applications

RF MEMS 소자 실장을 위한 LTCC 및 금/주석 공융 접합 기술 기반의 실장 방법

  • Bang, Yong-Seung (School of Electrical Engineering and Computer Science, Seoul National University) ;
  • Kim, Jong-Man (School of Electrical Engineering and Computer Science, Seoul National University) ;
  • Kim, Yong-Sung (School of Electrical Engineering and Computer Science, Seoul National University) ;
  • Kim, Jung-Mu (School of Electrical Engineering and Computer Science, Seoul National University) ;
  • Kwon, Ki-Hwan (Samsung Advanced Institute of Technology) ;
  • Moon, Chang-Youl (Samsung Advanced Institute of Technology) ;
  • Kim, Yong-Kweon (School of Electrical Engineering and Computer Science, Seoul National University)
  • 방용승 (서울대학교 전기.컴퓨터 공학부) ;
  • 김종만 (서울대학교 전기.컴퓨터 공학부) ;
  • 김용성 (서울대학교 전기.컴퓨터 공학부) ;
  • 김정무 (서울대학교 전기.컴퓨터 공학부) ;
  • 권기환 (삼성종합기술원) ;
  • 문창렬 (삼성종합기술원) ;
  • 김용권 (서울대학교 전기.컴퓨터 공학부)
  • Published : 2005.11.04
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Abstract

This paper reports on an LTCC-based packaging method using Au/Sn eutectic bonding process for RF MEMS applications. The proposed packaging structure was realized by a micromachining technology. An LTCC substrate consists of metal filled vertical via feedthroughs for electrical interconnection and Au/Sn sealing rim for eutectic bonding. The LTCC capping substrate and the glass bottom substrate were aligned and bonded together by a flip-chip bonding technology. From now on, shear strength and He leak rate will be measured then the fabricated package will be compared with the LTCC package using BCB adhesive bonding method which has been researched in our previous work.

Keywords