한국마이크로전자및패키징학회:학술대회논문집 (Proceedings of the International Microelectronics And Packaging Society Conference)
- 한국마이크로전자및패키징학회 2005년도 ISMP
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- Pages.51-65
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- 2005
Optimization of Chip Stack in 3D Packaging
- Hara Kazumi (Advanced Technology Development Department Seiko Epson corporation)
- 발행 : 2005.09.01