A Study on Manufacturing of Plastic Injection Mold for Warpage Characteristics of Mobile Phone Cover

모바일폰 커버의 휨특성 평가를 위한 금형 제작에 관한 연구

In the present study, warpage characteristics of mobile phone cover through injection molding process were investigated by using design of experiments. Warpage in plastic injection molding process has a significant effect on quality of product. Effects of injection time, packing pressure, packing time, mold temperature ana melt temperature on warpage of mobile phone cover were considered by CAE analysis and experiment with Taguchi method. The degree of warpage for the injection molded product was measured by using three dimensional CMM. It was shown that temperature parameter has more significant effect on the warpage of mobile phone cover than pressure parameter.