Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Effect of Compressive Stresses in Anisotropic Conductive Films (ACFs) on Contact Resistance of Flip Chip Joint

  • 권운성 (한국과학기술원 신소재공학과) ;
  • 백경욱 (한국과학기술원 신소재공학과)
  • Published : 2004.11.01
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