Development of control technique of nano-sized pattern for electroplating

나노급 도금공정을 위한 미세패턴 제어기술의 개발

The alumina membrane with nano sized pore was prepared from aluminum by anodic oxidation to apply for storage equipment, gas sensor and stamper. The pore size and cell size of the pores are controlled by anodic oxidation voltage. The alumina thickness was controlled by etching process using 0.2M $H_3PO_4$. The thickness of alumina on Si wafer was very accurately controlled by anodic oxidation time. Nickel with nano-sized grain was electroplated on the Au layer on silicon wafer. The fabricated pores on alumina membrane was the thickness of $7{\sim}10{\mu}m$ with straight nano-sized pore of 307${\sim}$120nm. The alumina by the etching process shows smooth surface. The size of Ni grain was 130nm and 250nm for 10mA/$cm^2$and 20mA/$cm^2$of electroplating currents, respectively.