Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 2003.07a
- /
- Pages.181-184
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- 2003
Stress Distribution of Indium-tin-oxide (ITO) Film on Flexible Substrate by Bending process
Flexible 기판 위의 Bending 처리에 따른 ITO 필름의 Stress 분포 특성
- Park, Jun-Back (Yonsei Univ.) ;
- Hwang, Jeoung-Yeon (Yonsei Univ.) ;
-
Seo, Dae-Shik
(Yonsei Univ.)
;
- Park, Sung-Kyu (Information Display Research Center, KETI) ;
- Moon, Dae-Gyu (Information Display Research Center, KETI) ;
-
Han, Jeong-In
(Information Display Research Center, KETI)
- 박준백 (연세대학교 전기전자공학과) ;
- 황정연 (연세대학교 전기전자공학과) ;
-
서대식
(연세대학교 전기전자공학과)
;
- 박성규 (전자부품연구원 디스플레이연구센터) ;
- 문대규 (전자부품연구원 디스플레이연구센터) ;
-
한정인
(전자부품연구원 디스플레이연구센터)
- Published : 2003.07.10
Abstract
In this paper, we investigated the position-dependent stress distribution of indium-tin-oxide (ITO) film on Polycarbonate (PC) substrate by external bending force. It was found that there are the maximum crack density at the center position and decreasing crack density as goes to the edge. In accordance with crack distribution, it was observed that the change of electrical resistivity of ITO islands is maximum at the center and decrease as goes to the edge. From the result that crack density is increasing at same island position as face-plate distance (L) decreases, it is evident that the more stress is imposed on same island position as L decreases.