대한전자공학회:학술대회논문집 (Proceedings of the IEEK Conference)
- 대한전자공학회 1998년도 하계종합학술대회논문집
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- Pages.867-870
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- 1998
Submicron device에서의 hot-carrier 열화에 관한 연구
A study hot-carrier degradation on submicron devices
초록
In this paper we simulated 0.30um NMOS transitor to analysis hot carrier degradation depend on As, As+P, P LDD structure. As a result we obtained As+P LDD structure was good hot carrier immunity. Also we find that hog carrier life time improved a sincresing P dose due to P dose helps in grading the nLDD junction. However As-only junction was poor due to junction high peak position located near the surface.
키워드