한국마이크로전자및패키징학회:학술대회논문집 (Proceedings of the International Microelectronics And Packaging Society Conference)

한국마이크로전자및패키징학회 (The Korean Microelectronics and Packaging Society)
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Solid Contents 에 따른 Ag Paste 의 특성 변화

Characterization of Ag Pastes with solid contents variation

  • 조현민 (전자부품연구원 고주파재료연구센터) ;
  • 유명재 (전자부품연구원 고주파재료연구센터) ;
  • 이우성 (전자부품연구원 고주파재료연구센터) ;
  • 양형국 ((주) 쏘닉스) ;
  • 박종철 (전자부품연구원 고주파재료연구센터)
  • 발행 : 2002.11.01
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초록

Silver pastes for inner conductor in the Low Temperature Co-fired Ceramics (LTCC) are composed of silver powder, binder, solvent and additives. The composition of the chemicals have influence on rheology, printability, shrinkage rate, etc. In this study, commercial Ag pastes and Ag pastes made in KETI were investigated to find the relationship between characteristics of Ag paste and solid contents. Ag pastes with 68~90 wt% Solid Contents were tested. Substrate/paste matching property and conductivity of the conductor lines showed large dependence on solid contents of Ag paste.

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