A study on micro grooving characteristics of planar lightwave circuit and glass using ultrasonic vibration cutting

초음파 진동절삭을 이용한 평면 광도파로와 유리의 미세 홈 가공특성에 관한 연구

Recent years, optical components'are widely used in optical communication industry for high speed and mass storage data processing. Micro grooving of planar lightwave circuit and glass, those are widely used in optical component, are realized by polycrystalline diamond tool with ultrasonic vibration. To know the characteristics of brittle materials cutting, ultrasonic vibration cutting tool and machining system are built for the experiment. Grooving on planar lightwave circuit and glass experiments are performed and their shape are measured by photograph with microscope. It reveals that better groove shape with low chipping of planar lightwave circuit and glass are obtained by micro grooving machining with ultrasonic vibration. These experiments are considered as a possibility to the micro grooving of optical communication components.