Proceedings of the KSME Conference (대한기계학회:학술대회논문집)
- 2001.06a
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- Pages.102-107
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- 2001
Analysis of Propagating Crack Along Interface of Isotropic-Orthotropic Bimaterial by Photoelastic Experiment
- Lee, K.H. (Sangju National University) ;
- Shukla, A. (University of Rhode Island) ;
- Parameswaran, V. (University of Rhode Island) ;
- Chalivendra, V. (University of Rhode Island) ;
- Hawong, J.S. (Yeoungnam University)
- Published : 2001.06.27
Abstract
Interfacial cracks between an isotropic and orthotropic material, subjected to static far field tensile loading are analyzed using the technique of photoelasticity. The fracture parameters are extracted from the full-field isochromatic data and the same are compared with that obtained using boundary collocation method. Dynamic Photoelasticity combined with high-speed digital photography is employed for capturing the isochromatics in the case of propagating interfacial cracks. The normalized stress intensity factors for static crack is greater when
Keywords
- Static and Dynamic Stress Intensity Factor;
- Interface Crack;
- Isotropic-Orthotropic Bimaterial;
- Energy Release Rate