• Transactions of the Korean Society of Mechanical Engineers A
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• v.25 no.7
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• pp.1055-1063
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• 2001

When the interfacial crack of isotropic/orthotropic bi-materials is propagated with constant velocity along the interface, stress and displacement components are derived in this research. The dynamic photoelastic experimental hybrid method for the bimaterial is introduced. It is assured that stress components and dynamic photoelastic hybrid developed in this research are valid. Separating method of stress components is introduced from only dynamic photoelastic fringe patterns. Crack propagating velocity of interfacial crack is 69∼71% of Rayleigh wave velocity of epoxy resin. The near-field stress components of bonded interface of bimaterial are similar with those of pure isotopic material and two dissimilar isotropic bimaterials under static or dynamic loading, but very near-field stress components of bonded interface of bimaterial are different from those.

• Proceedings of the KSME Conference
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• 2001.06a
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• pp.102-107
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• 2001

Interfacial cracks between an isotropic and orthotropic material, subjected to static far field tensile loading are analyzed using the technique of photoelasticity. The fracture parameters are extracted from the full-field isochromatic data and the same are compared with that obtained using boundary collocation method. Dynamic Photoelasticity combined with high-speed digital photography is employed for capturing the isochromatics in the case of propagating interfacial cracks. The normalized stress intensity factors for static crack is greater when $\alpha=90^{\circ}C$ (fibers perpendicular to the interface) than when $\alpha=0^{\circ}C$ (fiber parallel to the interface) and those when $\alpha=90^{\circ}C$ are similar to ones of isotropic material. The dynamic stress intensity factors for interfacial propagating crack are greater when $\alpha=0^{\circ}C$ than $\alpha=90^{\circ}C$. The relationship between complex dynamic stress intensity factor $|K_D|$ and crack speed C is similar to that for isotropic homogeneous materials, the rate of increase of energy release rate G or $|K_D|$ with crack speed is not as drastic as that reported for homogeneous materials.

• Journal of Mechanical Science and Technology
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• v.16 no.12
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• pp.1594-1603
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• 2002

In this paper, when the initial propagation angle of a branched crack is calculated from the maximum tangential stress criterion (MTSC) and the minimum strain energy density criterion (MSEDC), it is essential that you use stress components in which higher order terms are considered and stress components at the position in a distance 0.005㎜ from the crack tip (=r). When an interfacial crack propagates along the interface at a constant velocity, the initial propagation angles of the branched crack are similar. to the mode mixities (phase angle) and the theoretical values obtained from MTSC and MSEDC. The initial propagation angle of the branched crack depends considerably on the stress intensity factor K$_2$.

• Proceedings of the KSME Conference
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• 2000.11a
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• pp.292-297
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• 2000

In this research, the dynamic photoelastic experimental hybrid method for bimaterial is introduced. Dynamic biaxial loading device is developed, its strain rate is 31.637 s-1 and its maximum impact load is 20 ton. Manufactured methods for model of the dynamic photoelastic experiment for bimaterial are suggested. They are bonding method(bonding material: AW106, PC-1) and molding method. In the bonding method, residual stress is not occurred in the manufactured bimaterial. Crack is propagated along the interface or sometimes deviated from the interface. While in the molding method, residual stress is occurred in the manufactured bimaterial. Crack is always deviated from the interface and propagated in the epoxy region(softer materila). In order to propagate with constant velocity along the interface of bimaterial with arbitrary stiffer material, edge crack should be located along the interface of the acute angle side of the softer material in the bimaterial.

• Journal of Mechanical Science and Technology
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• v.16 no.2
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• pp.165-174
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• 2002

In the present study, interfacial cracks between an isotropic and orthotropic material, subjected to static far field tensile loading are analyzed using the technique of photoelasticity. The fracture parameters are extracted from the full-field isochromatic data and the same are compared with that obtained using boundary collocation method. Dynamic photoelasticity combined with high-speed digital photography is employed for capturing the isochromatics in the case of propagating interfacial cracks. The normalized stress intensity factors for static cracks are greate. when ${\alpha}$: 90$^{\circ}$(fibers perpendicular to the interface) than when ${\alpha}$=0$^{\circ}$(fibers parallel to the interface), and those when ${\alpha}$=90$^{\circ}$are similar to ones of isotropic material. The dynamic stress intensity factors for interfacial propagating cracks are greater when ${\alpha}$=0$^{\circ}$ than ${\alpha}$=90$^{\circ}$. For the velocity ranges (0.1 < C/C$\sub$s1/<0.7) observed in this study, the complex dynamic stress intensity factor │K$\sub$D/│increases with crack speed c, however, the rate of increase of │K$\sub$D/│with crack speed is not as drastic as that reported for homogeneous materials.