Analytical Methodology and Design Consideration of Advanced Test Structure for the Micromechanical Characteristics of MEMS device

초소형 박막구조물의 기계적 특성 평가소자 설계 및 분석 기법

  • Lee, Se-Ho (School of Materials Science and Engineering, Seoul National University) ;
  • Park, Byung-Woo (School of Materials Science and Engineering, Seoul National University) ;
  • kwon, Dong-Il (School of Materials Science and Engineering, Seoul National University)
  • Published : 1998.11.28

Abstract

In micromechanical system (MEMS) such as microactuators. thin film has been widely used as structural material. MEMS materials have difference with bulk in terms of mechanical properties. So, we design the advanced test structure for micromechanical properties of MEMS. The designed structure includes the newly developed pre-crack and it is driven by electrostatic force. To measure the fracture toughness, the pre-crack formation in the test structure is developed with conventional etching process. The advanced test structure is fabricated by application of semiconductor technology. After this, we propose analytical methodology to evaluate the fracture toughness and fatigue properties through a prediction of crack behavior from the variations of stiffness and frequency. Additionally, life time of a mirror plane used in DVD(Digital Video Disk) is measured as a function of capacitance and applied voltage under the accelerated conditions. Ultimately, we propose the method to evaluate the micromechanical reliabilities of the MEMS materials using the advanced test structure.

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