• 전기학회논문지P
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• 제58권2호
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• pp.196-201
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• 2009

In this paper, We developed specifications light-way lighting appliance for efficient construction Wiring embody lighting appliance is convenient for divergence of circuit and arrangement construction of lamp. Also, it can be shortened construction period because series construction is available. Improved product is high work efficiency because the volume is small and the weight is light. Power line and line of communication are received each tray, so equipment is secure. We believe that the product is available for gallery, museum, and parking lot etc.

• 한국자동차공학회논문집
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• 제4권2호
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• pp.32-49
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• 1996

An approach to providing computational support for concurrent design is discussed in the context of an automobile wiring harness design problem. Key issues include the development of an architecture that supports collaboration among specialists, the development of hierarchical representations that capture different characteristics of the design, and decomposition of tasks to achieve a tradeoff between efficiency and robustness of the system. We present an architecture in which the main design tasks are supported by agents-asynchronous and semi-autonomous modules that automate routine design tasks and provide specialized interfaces for working on particular aspects of the design. The agent communication and coordination mechanisms permit members of an engineering team to work concurrently, at different levels of detail and of different versions of the design. The design is represented hierarchically, with detailed models maintained by the participating agents. In conjunction with the architecture and design representations, issues pertaining to the exchange of information among different views of the design, management of dependencies and constraints, and propagation of design changes are discussed.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2001년도 ICCAS
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• pp.104.2-104
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• 2001

In the intelligent integrated systems, the delay time must be reduced using highly parallel processors, as well as high throughput performance. In this paper, we propose a new concept for building 3D highly parallel processors using multi-layer printed wiring boards with built-in soldering heater (BISH-PWB). The proposed BISH is realized with the long and narrow cupper wiring pattern on the internal layer in the terminal pattern area. Based on the linearity of the cupper resistance vs. temperature, we can measure the BISH, temperature and its calorific value from the heater voltage and current measurements. If we provide the BISH temperature control systems for each BISH, selective multi-point soldering can be realized with same ...

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2001년도 ICCAS
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• pp.174.2-174
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• 2001

Increasing demand for safety features, driving comfort and operational convenience in automobiles requires an intensive use of electronic components such as sensors, actuators and Electronic Control Unit(ECU)'s. These growing number of electronics has given rise to problems concerning the increasing number, size and weight of the wiring harnesses. In order to resolve these problems, multiplexed wiring systems such as Controller Area Network(CAN) serial communication protocol are applied in vehicle. This paper introduces the development of Body Control Module(BCM)s using multiplexed wiring systems. The BCM's were developed and implemented using CAN, the most popular choice of in-vehicle communication protocols.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1997년도 춘계학술대회 논문집
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• pp.362-365
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• 1997

In the field of Micro-Mechanics, it has been known diffcult to integrate the micro-machine with sensor and source line for the conventional copper line cnanot be used in compact and small size. We developed a system to make thethin copper film as a connect line on the poyurethane pipe (2mm in diameter) by the evaporation technique. This system consists of an evaporation chamber two long branches, substrate hoider and a Linear-Rotary motion feed feedthrough. The results showed that thin copper film coated polyurethanc pipe could be applied th the small medical devices such as the micro active endoscope.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2000년도 추계종합학술대회 논문집(3)
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• pp.153-156
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• 2000

A novel silicon retina chip based on the information processing in the vertebrate retina was designed. The chip has a novel wiring structure in which all pixels are connected through the channel of MOS transistors, which simplifies a wiring structure compared with conventional resistive networks. The proposed structure minimizes the pixel area and certainly increases a fill factor since each pixel consists of only two photodiodes and three MOS transistors. It also enables the chip to operate over a wide range of light intensity by adjusting its conductance with the gate voltage. Simulation results with SPICE showed that the chip could extract the edge of input images successfully.

• 한국레이저가공학회지
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• 제2권3호
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• pp.32-41
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• 1999

This study is about Jig used in wiring when we make Probecard and Large Scale Intergrated Electronic Circuit. The most universal wiring method is molding with Bond. Polymer film is punched down and adhesives is applied after wiring. Due to shrinkage and modification many problems still have happened in the process of molding. To solve these problems, ceramic plate was introduced in the study. Using Laser, an experiment of microhole treatment on ceramic plate was proceeded. Laser energy, assistance gas, and special features by purity degree were analyzed with the 35W low capacity YAG-Laser. In the condition of energy 0.08J, frequency 20Hz and interval time 200$mutextrm{s}$, about 70${\mu}{\textrm}{m}$ microhole was adequate for the Probecard Jig. In the purity experiment of ceramic materials, high purity ceramic met with good result for microhole. But the price is too high. The shape and size of holes machined combustion gas $O_2$ were better than those in $N_2$ and Ar, the inert gas.

• 전기의세계
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• 제20권4호
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• pp.5-11
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• 1971

This is a study on the insulation methods of home appliances and wiring devices proper to the new electric distribution system, primary side is 22.9/13.2KV, 3 phase 4 wire multigrounding system and secondary side is 380/220V, 3 phase 4 wire common neutral system. 1800V is determined as the electrical insulation voltage of the functional insulation because the abnormal voltage rise of the neutral line is 1300V. In the case of the functional insulation faults, the following safety methods will be suggested to protect the accidental faults: (a) class I appliance (accessible metal part is earthed), (b) class II appliance (doublly insulated), (c) class III appliance (operates at low voltage source). The mechanisms of the wiring devices are not improved to guarantee for the harmful electric shock but also the electrical insulation voltage is rised to 2000V.

• 한국CDE학회논문집
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• 제8권3호
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• pp.184-188
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• 2003

The harness design process consists of repetitious routines to decide the wire configuration in its interior. A slight change in one of the wire's configuration will require a total reconfiguration of the entire wire system. Therefore, the harness design is extremely time consuming and is vulnerable to human errors by an engineer. Based on both electrical and mechanical area, Wiring Harness system is in complicated area. Existing systems are, therefore, not exactly suitable for practical use. This paper presents a novel framework for ameliorating existing system's defects. In this paper, Visio and Visual Basic was interfaced to process wire bundle information and wire bundle location to alleviate problems mentioned beforehand concerning harness design; at the same time developing the automation of the entire design process based on the feature based design method, optional print, and management of documents for reuse.

• Smart Structures and Systems
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• 제2권1호
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• pp.25-46
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• 2006

Aging wiring in buildings, aircraft and transportation systems, consumer products, industrial machinery, etc. is among the most significant potential causes of catastrophic failure and maintenance cost in these structures. Smart wire health monitoring can therefore have a substantial impact on the overall health monitoring of the system. Reflectometry is commonly used for locating faults on wire and cables. This paper compares Time domain reflectometry (TDR), frequency domain reflectometry (FDR), mixed signal reflectometry (MSR), sequence time domain reflectometry (STDR), spread spectrum time domain reflectometry (SSTDR) and capacitance sensors in terms of their accuracy, convenience, cost, size, and ease of use. Advantages and limitations of each method are outlined and evaluated for several types of aircraft cables. The results in this paper can be extrapolated to other types of wire and cable systems.