• 유체기계공업학회:학술대회논문집
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• 유체기계공업학회 2006년 제4회 한국유체공학학술대회 논문집
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• pp.479-482
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• 2006

The most the electronic industry has recently accelerated the modularization, the miniaturization and the high integrated trend of electronics fields such as electronics components, appliances and etc., the most increasingly the heat generation problem rises. Even though the conventional cooling technologies are widely used in order to reduce the heat loads, the technologies are not easy to meet the present trends due to the fact that most of many conventional methods are relative to external form environments such as size, design and so on. With regardless of those environments, however, a heat pipe is one of the most efficient systems to improve the heat transfer performance. And then the performance of the heat pipe depends on a wick structure. Of various wick structures, sintered metal wick is known so that it has some advantages such as smaller pore size, increasing porosity as well as high reliability. In this study sintered metal wicks, thickness 0.7 mm, 0.8 mm and 0.9 mm, were manufactured as of $100{\mu}m$ copper powder to obtain the manufacturing technology of heat pipes mounted with a sintered metal wick. Furthermore, experiments for the operational performance factors such as capillary limit, thermal resistance were not only performed but also compared with a theoretical model simultaneously. Experimental results agreed with the theoretical model, and then it seems to be required to study various development processes of sintered metal wicks for the high performance of a heat pipe system.

• 대한기계학회논문집B
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• 제25권6호
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• pp.799-803
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• 2001

Miniature heat pipe(MHP) with woven-wired wick was used to cool the CPU of a notebook PC. The pipe with circular cross-section was pressed and bent for packaging the MHP into a notebook PC with very limited compact packaging space. A cross-sectional area of the pipe is reduced about 30% as the MHP with 4mm diameter is pressed to 2mm thickness. In the present study a performance test has been performed in order to review varying of operating performance according to pressed thickness variation and heat dissipation capacity of MHP cooling module that is packaged on a notebook PC. New wick type was considered for overcoming low heat transfer limit when MHP is pressed to thin-plate. The limiting thickness or pressing is shown to be within the range of 2mm∼2.5mm through the performance test with varying the pressing thickness. When the wall thickness of 0.4mm is reduced to 0.25mm for minimizing conductive thermal resistance through the wall of heat pipe, heat transfer limit and thermal resistance of MHP were improved about 10%. In the meantime, it is shown that the thermal resistance and heat transfer limit for the MHP with central wick type are higher than those of MHP with existing wick types. The results of performance test for MHP cooling modules with woven-wired wick to cool a notebook PC shows the stability as cooling system since T(sub)j(Temperature of Processor Junction) satisfy a demand condition of 0∼100$\^{C}$ under 11.5W of CPU heat.

• Tribology and Lubricants
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• 제38권5호
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• pp.185-190
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• 2022

Among the operating limits of a heat pipe, the capillary limit is significantly affected by the characteristics of the wick, which is determined by the capillary performance. The major parameters for determining capillary performance are the maximum capillary pressure and the spreading characteristics that can be expected through the wick. A well-designed wick structure improves capillary performance and helps improve the stability of the heat pipe by enhancing the capillary limit. The capillary performance can be improved by forming a porous microstructure on the surface of the wick structure through surface modification techniques. In this study, a microstructure is formed on the surface of the wick by using a surface modification method (i.e., an electrochemical etching process). In the experiment, specimens are prepared using stainless-steel screen mesh wicks with various fabrication conditions. In addition, the spreading and capillary rise performances are observed with low-surface-tension fluid to quantify the capillary performance. In the experiments, the capillary performance, such as spreading characteristics, maximum capillary pressure, and capillary rise rate, improves in the specimens with microstructures formed through surface modification compared with the specimens without microstructures on the surface. The improved capillary performance can have a positive effect on the capillary limit of the heat pipe. It is believed that the surface microstructures can enhance the operational stability of heat pipes.

• Nuclear Engineering and Technology
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• 제56권6호
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• pp.2029-2038
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• 2024

A deep understanding of the characteristics and mechanism of geyser boiling and capillary pumping is necessary to optimize a high-temperature sodium heat pipe. In this work, the Volume of Fluid (VOF) two-phase model and the capillary force model in the mesh wick were used to model the complex phase change and fluid flow in the heat pipe. Computational Fluid Dynamics (CFD) simulations successfully predicted the process of bubble nucleation, growth, aggregation, and detachment from the wall in the liquid pool of the evaporation section of the heat pipe in horizontal and tilted states, as well as the reflux phenomenon of capillary suction within the wick. The accuracy and stability of the capillary force model within the wick were verified. In addition, the causes of geyser boiling in heat pipes were analyzed by extracting the oscillation distribution of heat pipe wall temperature. The results show that adding the capillary force model within the wick structure can reasonably simulate the liquid backflow phenomenon at the condensation; Under the horizontal and inclined operating conditions of the heat pipe, the phenomenon of local dry-out will occur, resulting in a sharp increase in local temperature. The speed of bubble detachment and the timely reflux of liquid sodium (condensate) replenishment in the wick play a vital role in the geyser temperature oscillation of the tube wall. The numerical simulation method and the results of this study are anticipated to provide a good reference for the investigation of geyser boiling in high-temperature heat pipes.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회B
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• pp.2130-2135
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• 2007

Operating characteristics of a loop heat pipe (LHP) having a bypass line was investigated experimentally. The LHP had a sintered metal wick as a capillary structure and methanol as a working fluid. The sintered metal wick was made of stainless steel of which the average pore size was 5 ${\mu}m$and porosity of 47%. A bypass line of a small diameter was attached between the vapor escape passage and the liquid reservoir. The dimension of the flat evaporator was $50(L){\times}40(W){\times}30(H)$ mm and that of the condenser was $50(L){\times}40(W){\times}11(H)$ mm. Wall and pipe material of the LHP was stainless steel and heating area was 35(W) mm${\times}$35(L) mm. The inner diameters of vapor and liquid transport lines were 4.0 mm and 2.0 mm, and the lengths of the two lines were both 0.5 m. The LHP was tested for three different tilt angles of horizontal, favorite tilt, and adverse tilt. The thermal load range was up to 290 W at the condenser above evaporation position. Furthermore, the effect of a bypass line on the start-up transient as well as steady-state operation was presented and discussed.

• Journal of Mechanical Science and Technology
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• 제19권4호
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• pp.1052-1061
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• 2005

A small-scale loop heat pipe (LHP) with polypropylene wick was fabricated and tested for investigation of its thermal performance. The container and tubing of the system were made of stainless steel and several working fluids were tested including methanol, ethanol, and acetone. The heating area was $35\;mm\;{\times}\;35\;mm$ and nine axial grooves were provided in the evaporator to provide vapor passages. The pore size of the polypropylene wick inside the evaporator was varied from $0.5\; {\mu}m\;to\;25\;{\mu}m.$ The inner diameter of liquid and vapor transport lines were 2.0 mm and 4.0 mm, respectively and the length of which were 0.5 m. The size of condenser was $40\;mm\;(W)\;{\times}\;50\;mm\;(L)$ in which ten coolant paths were provided. Start-up characteristics as well as steady-state performance was analyzed and discussed. The minimum thermal load of $10\;W\;(0.8\;W\;/cm^{2})$ and maximum thermal load of $80\;W\;(6.5\;W\;/cm^{2})$ were achieved using methanol as working fluid with the condenser temperature of $20^{\circ}C$ with horizontal position.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회B
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• pp.2357-2362
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• 2008

LHP is different from a conventional heat pipes in design and heat and fluid flow passages. The situations of the former is much complex than the latter. In LHPs, evaporation occurs at the contact interface between the heating plate and the porous wick, so some micro channels machined at the contact interface serve to let the vapor flow out of the evaporator. This complexity of contact geometry was known to cause a high resistance to heat flow. The present work was to study the problem of heat passage across the contact surface for LHPs and determine those values contact resistance. For two cases of contact structures, the thermal contact resistances were examined experimentally, one being obtained through mechanical contact under pressure and the other through sintered bonding. Nickel powder wick and copper plate were used for specimens. The result showed that a substantial reduction of contact resistance of an order of degree could be obtainable by sintered bonding.

• 한국지반공학회지:지반
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• 제3권1호
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• pp.7-24
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• 1987

울산만 북서측 임해지역체 발달된 연약해성점토를 개양하기 위하려 선행대중과 Wick Drain공법의 병용공법이 적용되었다. 상기 공법의 적용에 따른 연약해성점토의 거동 및 강침특성을 요명하여, 안전하고 신속하게 시공을 실시하기 위하여 현장계측에 의한 공학적인 시공관리를 실시하였다. 본 고는 연약해성점토를 개량하기 위하여 적용한 선행하중과 Wick Drain공법의 설계, 시공 및 안전관리방법을 수록하고 있다.

• 대한기계학회논문집
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• 제10권5호
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• pp.713-723
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• 1986

본 논문에서는 비금속성 재질(SiO$_{2}$)로 만든 윅의 열전달 특성을 실험적 해석적 방법으로 연구했다. 먼저 비금속 윅을 단독으로만 실험하여 해석해와의 일치 성을 밝히고, 윅의 성능 개선을 위해 결합재의 첨가가 히이트파이프 증발부의 열전달 에 미치는 영향을 ADI해석 해법으로 예측하였다. 따라서 고온용 히이트파이프 뿐만 아니라 ,저온용에서도 비금속윅의 사용을 위한 가치 판단을 하고 비금속성 재질(SiO S12 등)이 윅으로서 넓게 이용 될수 있다는 가능성을 제시하는데 그 목적이 있다.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2001년도 춘계학술대회논문집D
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• pp.572-578
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• 2001

This study is to research the heat transfer characteristics in copper-water heat pipes with screen wick, #100. Recently, the semiconductor capacity of an electronic unit has been larger, on the contrary, its size is smaller than before. As a result, a high-performance cooling system is needed. Experimental variables are inclination angle and temperature of cooling water. The distilled water was used for the working fluid. At a inclination angle ${-6}^{\circ}$, #100 2layer screen mesh is shown the best heat transfer performance.