• Journal of Powder Materials
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• v.25 no.2
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• pp.158-164
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• 2018

Multi-walled carbon nanotube (MWCNT)-copper (Cu) composites are successfully fabricated by a combination of a binder-free wet mixing and spark plasma sintering (SPS) process. The SPS is performed under various conditions to investigate optimized processing conditions for minimizing the structural defects of CNTs and densifying the MWCNT-Cu composites. The electrical conductivities of MWCNT-Cu composites are slightly increased for compositions containing up to 1 vol.% CNT and remain above the value for sintered Cu up to 2 vol.% CNT. Uniformly dispersed CNTs in the Cu matrix with clean interfaces between the treated MWCNT and Cu leading to effective electrical transfer from the treated MWCNT to the Cu is believed to be the origin of the improved electrical conductivity of the treated MWCNT-Cu composites. The results indicate the possibility of exploiting CNTs as a contributing reinforcement phase for improving the electrical conductivity and mechanical properties in the Cu matrix composites.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.320-320
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• 2011

We describe fabrication of superhydrophobic surface on non-woven fabric (NWF) having nano-hairy structures and a hydrophobic surface coating. Oxygen plasma was irradiated on NWF for nano-texuring and a precursor of HMDSO (Hexamethydisiloxane) was introduced as a surface chemical modification for obtaining superhydrophobicity using 13.56 MHz radio frequency-Plasma Enhanced Chemical Vapor Deposition (rf-PECVD). O2 plasma treatment time was varied from 1 min to 60 min at a bias voltage of 400V, which fabricated pillar-like structures with diameter of 30 nm and height of 150 nm on NWF. Subsequently, hydrophobic coating using hexamethyldisiloxane vapor was deposited with 10 nm thickness on NWF substrate at a bias voltage of 400 V. We evaluate superhydrophobicity of the modified NWF with sessile drop using goniometer and high speed camera, in which aspect ratio of nanohairy structures, contact angle and contact angle hysteresis of the surfaces were measured. With the increase of aspect ratio, the wetting angle increased from $103^{\circ}$ to $163^{\circ}$, and the contact angle hysteresis decreased dramatically below $5^{\circ}$. In addition, we had conducted experiment for nucleation and condensation of water via E-SEM. During increasing vapor pressure inside E-SEM from 3.7 Torr to over 6 Torr which is beyond saturation point at $2^{\circ}C$, we observed condensation of water droplet on the superhydropobic NWF. While the condensation of water on oxygen plasma treated NWF (superhydrophilic) occurred easily and rapidly, superhydrophobic NWF which was fabricated by oxygen and HMDSO was hardly wet even under supersaturation condition. From the result of wetting experiment and water condensation via E-SEM, it is confirmed that superhydrophobic NWF shows the grate water repellent abilities.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.4
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• pp.109-114
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• 2021

We investigated the effects of atmospheric hydrogen plasma treatment on Cu-Cu direct bonding. Hydrogen plasma was effective in reducing the surface oxide layer of Cu thin film, which was confirmed by GIXRD analysis. It was observed that larger plasma input power and longer treatment time were effective in terms of reduction and surface roughness. The interfacial adhesion energy was measured by DCB test and it was observed to decrease as the bonding temperature decreased, resulting in bonding failure at bonding temperature of 200℃. In case of wet treatment, strong Cu-Cu bonding was observed above bonding temperature of 250℃.

• Journal of the Korean Society of Combustion
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• v.4 no.1
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• pp.27-38
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• 1999

We constructed a wire-cylinder type pulsed corona discharge system for $NO_x$ removal, which was operated in room temperature. A emission spectrometer was built with a boxcar averager and monochrometer equipped with photo-multiplier tube detector. The sensitivity of the emission spectrometer was greatly improved by synchronizing the emission spectrometer with pulsed corona discharge system using a triggered spark-gap switch. $N_2$ spectrum($c^3{\Pi}_u{\rightarrow}X^1{\Sigma}_g{^+}$) was measured in the range of 300 - 450 nm and oxidizing OH radical emission($A^2{\Sigma}^+{\rightarrow}X^2{\Pi}$) was measured in case $N_2$ was supplied with water bubbling. As wet gas composition of inlet $N_2$ supplied in the discharge system increased, the intensity of OH emission was increased and saturated at wet gas composition 50%. We also investigated additive effect of $C_2H_4,\;H_2O,\;H_2O_2$ on the intensity of OR emission and $NO/NO_2/NO_x$ reduction and analysed the related reaction mechanism in corona discharge process. $H_2O_2$ additive increased the intensity of OH emission and $NO/NO_x$ reduction.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.28A no.11
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• pp.902-909
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• 1991

A reproducible selective dry etch process of GaAs/AlGaAs Heterostructures for High Electron Mobility Transistor(HEMT) Device fabrication is developed. Using RIE mode with $CCl_{2}F_{2}$ as the basic process gas, the observed etch selectivity of GaAs layer with respect to GaAs/$Al_{0.3}Ga_{0.7}$As is about 610:1. Severe polymer deposition problem, parialy generated from the use of $CCl_{2}F_{2}$ gas only, has been significantly reduced by adding a small amount of He gas or by $O_{2}$ plasma ashing after etch process. In order to obtain an optimized etch process for HEMT device fabrication, we com pared the properties of the wet etched Schottky contact with those of the dry etched one, and set dry etch condition to approach the characteristics of Schottky diode on wet etched surface. By applying the optimized etch process, the fabricated HEMT devices have the maximum transconductance $g_{mext}$ of 224 mS/mm, and have relatively uniform distribution across the 2inch wafer in the value of 200$\pm$20mS/mm.

• Journal of Korean Society of Occupational and Environmental Hygiene
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• v.23 no.4
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• pp.333-340
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• 2013

Objectives: This study was designed to establish an accurate analytical method for asbestos in a biological sample for determining occupational asbestos-related diseases and relief of the health effects of environmental asbestos. Methods: Biological samples were obtained from lungs of rats following intratracheal instillation of asbestos(Chrysotile, anthophyllite) and were prepared according to digestion method(Wet digestion, high temperature ashing, low temperature ashing). The samples were then analyzed for asbestos fibers using a transmission electron microscope equipped with an energy dispersive X-ray spectrometer. Results: Low temperature plasma ashing removed more of the organic components and reduced fiber loss compared to the wet digestion method, making specimens so prepared more suitable for transmission electron microsocpy. Conclusions: The low temperature ashing technique is the most accurate method for analyzing asbestos in biological samples.

• Journal of the Korean Vacuum Society
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• v.17 no.2
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• pp.113-116
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• 2008

As the integration in semiconductor display develops, semiconductor process becomes multilayer. In order to form several layer patterns, etching process which uses photoresistor (PR) must be performed in multilayer process. Repeated etching processes which take long time and PR residue cause mortal problems in semiconductor. To overcome such problems, we studied about the solution which eliminates PR effectively by using normal dry and wet etching method using plasma activated PR strip solvent in liquid condition. At first, we simulate the device which activates the plasma and make sure whether gas flow in device is uniform or not. Under activated plasma, etching effect is elevated. This improvement reduces etching time as well as display production time of semiconductor process. Generally, increasing etching process increases environmental hazards. Reducing etching process can save the etchant and protect environment as well.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.245-245
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• 2012

Syntheses of oxide supported metal catalysts by wet-chemical routes have been well known for their use in heterogeneous catalysis. However, uniform deposition of metal nanoparticles with controlled size and shape on the support with high reproducibility is still a challenge for catalyst preparation. Among various synthesis methods, arc plasma deposition (APD) of metal nanoparticles or thin films on oxide supports has received great interest recently, due to its high reproducibility and large-scale production, and used for their application in catalysis. In this work, Au and Pt nanoparticles with size of 1-2 nm have been deposited on titania powder by APD. The size of metal nanoparticles was controlled by number of shots of metal deposition and APD conditions. These catalytic materials were characterized by x-ray diffraction (XRD), inductively coupled plasma (ICP-AES), CO-chemisorption and transmission electron microscopy (TEM). Catalytic activity of the materials was measured by CO oxidation using oxygen, as a model reaction, in a micro-flow reactor at atmospheric pressure. We found that Au/$TiO_2$ is reactive, showing 100% conversion at $110^{\circ}C$, while Pt/$TiO_2$ shows 100% conversion at $200^{\circ}C$. High activity of metal nanoparticles suggests that APD can be used for large scale synthesis of active nanocatalysts. We will discuss the effect of the structure and metal-oxide interactions of the catalysts on catalytic activity.

• Journal of the Korean Vacuum Society
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• v.19 no.2
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• pp.114-120
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• 2010

Conventional surface texturing in crystalline silicon solar cell have been use wet texturing by Alkali or Acid solution. But conventional wet texturing has the serious issue of wafer breakage by large consumption of wafer in wet solution and can not obtain the reflectance below 10% in multi crystalline silicon. Therefore it is focusing on RIE texturing, one method of dry etching. We developed large scale plasma RIE (Reactive Ion Etching) equipment which can accommodate 144 wafers (125 mm) in tray in order to provide surface texturing on the silicon wafer surface. Reflectance was controllable from 3% to 20% in crystalline silicon depending on the texture shape and height. We have achieved excellent reflectance below 4% on the weighted average (300~1,100 nm) in multi crystalline silicon using plasma texturing with gas mixture ratio such as $SF_6$, $Cl_2$, and $O_2$. The texture shape and height on the silicon wafer surface have an effect on gas chemistry, etching time, RF frequency, and so on. Excellent conversion efficiency of 16.1% is obtained in multi crystalline silicon by RIE process. In order to know the influence of RF frequency with 2 MHz and 13.56 MHz, texturing shape and conversion efficiency are compared and discussed mutually using RIE technology.

• Polymer(Korea)
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• v.34 no.3
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• pp.226-236
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• 2010

UV irradiated acrylic pressure sensitive adhesives(PSAs) are prepared to be used for thermal pad in plasma display panel(PDP). The effect of the chemical structure of side-chain in comonomer and of crosslinking agent on wet-out property of acrylic PSAs in wide temperature range were investigated. The correlationship between viscoelastic behavior and adhesion properties, such as tack and peel strength, was also studied. The experimental results supported that wet-out and adhesion properties of acrylic PSAs were enhanced inversely proportional to side-chain length of comonomer in wide temperature range. The peel energy clearly increased in acrylic PSAs prepared by using di(ethylene glycol) dimethylacrylate (DEGDMA) for crosslinking agent. The results might be due to the difference in the glass transition temperature and viscoelastic behavior of acrylic PSAs.