• Journal of Industrial Technology
• /
• v.3
• /
• pp.103-116
• /
• 1983

Recent developments in multi-storey buildings for residential purpose have led to the extensive use of shear walls for the basic structural system. When the coupled shear wall system is used, joined together with cast-in-place concrete or mortar (or grout), the function of the continuous joints is a crucial factor in determining the safety of L.P. Precast concrete shear wall structures, because the function of the continuous joints(Vertical wall to wall joints) is to transfer froces from one element(shear wall panel) to another, and if sufficient strength and ductility is not developed in the continuous joints, the available strength in the adjoining elements may not be fully utilized. In this paper, the influence of the stiffness of vertical joints(wet vertical keyed shear joints) on the behaviour of precast shear walls is theoretically investigated. To define how the stiffness of the vertical joints affect the load carrying capacity of L.P.Precast concrete shear wall structure, the L.P.Precast concrete shear wall structure is analyzed, with the stiffness of the vertical joints varying from $K=0.07kg/mm^3$(50MN/m/m) to $K=1.43kg/mm^3$(1000MN/m/m), by using the continuous connection method. The results of the analysis shows that at the low values of the vertical stiffness, i.e. from $K=0.07kg/mm^3$(50MN/m/m) to $K=0.57kg/mm^3$(400MN/m/m), the resisting bending moment and shearing force of precast shear walls, the resisting shearing force of vertical joints and connecting beams are significantly affected. The detailed results of analysis are represented in the following figures and Tables.

• Journal of Korea Technical Association of The Pulp and Paper Industry
• /
• v.44 no.4
• /
• pp.77-84
• /
• 2012

The lithographic process depends on a satisfactory ink-in-water emulsion being formed during printing and the speed of wet presses makes the choice of fountain solution vitally important as the ink and fount must react quickly to form a stable emulsion. Ink and water come into contact with each other on the rolls of the press and are forced together in the roll nips. The water is not soluble in the ink since it is slightly fat. Instead, an emulsion is formed, a heterogeneous mass consisting of small water drops mixed into the ink, if the water feed is too great. This emulsification can affect the properties of an off-set ink and negatively affect the printability. So we investigated the effects of the emulsification of phenol free heat-set ink and existing heat-set ink on printed quality, such as amount of ink transfer, printed density, print-through and uniformity. We used Duke emulsification tester for the emulsification of inks, and used IGT printability tester for printed quality. The printed quality were measured by densitometer and were evaluated by the image analysis system. Compared to conventional printing ink, phenol-free ink showed better results of the printability at the emulsification.

• Journal of Electrochemical Science and Technology
• /
• v.14 no.1
• /
• pp.96-104
• /
• 2023

Synergistically increased oxygen evolution reaction (OER) of manganese oxide (MnO₂) catalyst is introduced with surface-modified halloysite nanotube (Fe₃O₄-HNTs) structure. The flake shaped MnO₂ catalyst is attached on the nanotube template (Fe₃O₄-HNTs) by series of wet chemical and hydrothermal method. The strong interaction between MnO₂ and Fe₃O₄-HNTs maximized active surface area and inter-connectivity for festinate charge transfer reaction for OER. The synergistical effect between Fe₃O₄ layer and MnO₂ catalyst enhance the Mn³⁺/Mn⁴⁺ ratio by partial replacement of Mn ions with Fe. The relatively increased Mn³⁺/Mn⁴⁺ ratio on MnO₂@FHNTs induced 𝜎^* orbital (e_g) occupation close to single electron, improving the OER performances. The MnO₂@FHNTs catalyst exhibited the reduced overpotential of 0.42 V (E vs. RHE) at 10 mA/cm² and Tafel slope of (99 mV/dec), compared with that of MnO₂ with unmodified HNTs (0.65 V, 219 mV/dec) and pristine MnO₂ (0.53 V, 205 mV/dec). The present study provides simple and innovative method to fabricate nano fiberized OER catalyst for a broad application of energy conversion and storage systems.

• Composites Research
• /
• v.36 no.5
• /
• pp.377-382
• /
• 2023

To enhance the performance of graphene-based devices, it is of great importance to better understand the interfacial interaction of graphene with its underlying substrates. In this study, the adhesion energy of monolayer graphene placed on dielectric substrates was characterized using mode I fracture tests. Large-area monolayer graphene was synthesized on copper foil using chemical vapor deposition (CVD) with methane and hydrogen. The synthesized graphene was placed on target dielectric substrates using polymer-assisted wet transfer technique. The monolayer graphene placed on a substrate was mechanically delaminated from the dielectric substrate by mode I fracture tests using double cantilever beam configuration. The obtained force-displacement curves were analyzed to estimate the adhesion energies, showing 1.13 ± 0.12 J/m² for silicon dioxide and 2.90 ± 0.08 J/m² for silicon nitride. This work provides the quantitative measurement of the interfacial interactions of CVD-grown graphene with dielectric substrates.

• Journal of the Korea institute for structural maintenance and inspection
• /
• v.11 no.1
• /
• pp.95-102
• /
• 2007

It needs to Prevent damage as aging shotcrete itself exists as a dangerous component to comuting vehicles or infrastructure due to scaling, spaling, and loosening. However, it is hard to make an approach owing to a steep slope and high work, and there has been indicated a limit that it is difficult to grasp the internal condition of shotcrete on the surface. This study aimed to research internal defects that cannot be observed from the surface, by measuring a subtle thermal transfer on the shotcrete surface by using infrared thermography for overcoming such a technical limit. As a result of conducting an inspection through an analysis on measured data and fieldwork using an endoscope camera, it was impossible to accurately determine the wet part because of an excessive coating of shotcrete, yet, This study is proposed effictively extract a void part of the inside with non-destructive and non-touching method.

• Tunnel and Underground Space
• /
• v.9 no.4
• /
• pp.306-314
• /
• 1999

In underground spaces including nuclear waste repository, prediction of air quantity, temperature/humidity and pollutant concentration is utmost important for space construction and management during the normal state as well as for determining the measures in emergency cases such as underground fires. This study aims at developing a model for underground space environment which has capabilities to take into account the effects of autocompression for the natural ventilation head calculation, to find the optimal location and size of fans and regulators, to predict the temperature and humidity by calculating the convective heat transfer coefficient and the sensible and latent heat transfer rates, and to estimate the pollutant levels throughout the network. The temperature/humidity prediction model was applied to a military storage underground space and the relative differences of dry and wet temperatures were 1.5 ~ 2.9% and 0.6 ~ 6.1%, respectively. The convection-based pollutant transport model was applied to two different vehicle tunnels. Coefficients of turbulent diffusion due to the atmospheric turbulence were found to be 9.78 and 17.35$m^2$/s, but measurements of smoke and CO concentrations in a tunnel with high traffic density and under operation of ventilation equipment showed relative differences of 5.88 and 6.62% compared with estimates from the convection-based model. These findings indicate convection is the governing mechanism for pollutant diffusion in most of the tunnel-type spaces.

• Applied Chemistry for Engineering
• /
• v.29 no.5
• /
• pp.510-518
• /
• 2018

Recently, lots of interests have been concentrated on the scrubber system that abates waste gases produced from semiconductor manufacturing processes. An effective design of the thermal decomposition reactor inside a scrubber system is significantly important since it is directly related to the removal performance of pollutants and overall stabilities. In the present study, a computational fluid dynamics (CFD) analysis was conducted to figure out the thermal and flow characteristics inside the reactor of wet scrubber. In order to verify the numerical method, the temperature at several monitoring points was compared to that of experimental results. Average error rates of 1.27~2.27% between both the results were achieved, and numerical results of the temperature distribution were in good agreement with the experimental data. By using the validated numerical method, the effect of the reactor geometry on the heat transfer rate was also taken into consideration. From the result, it was observed that the flow and temperature uniformity were significantly improved. Overall, our current study could provide useful information to identify the fluid behavior and thermal performance for various scrubber systems.

• Proceedings of the Korean Society of Crop Science Conference
• /
• 2017.06a
• /
• pp.44-44
• /
• 2017

Recently, the occurrences of extreme flooding and drought, often in the same areas, have increased due to climate change. We tested the hypothesis that wetland species could help upland species under flood conditions; that is, the roots of wetland crops may supply $O_2$ to the roots of upland crops by a series of experiments conducted in both humid Japan and semi-arid Namibia (See Iijima et al, 2016 and Awala et al, 2016). Firstly, flooding tolerance of upland-adapted staple crops-pearl millet (Pennisetum glaucum) and sorghum (Sorghum bicolor) mix-cropped with rice (Oryza spp.) was investigated in glasshouse and laboratory experiments in Japan. We found a phenomenon that strengthens the flood tolerance of upland crops when two species-one wetland and one drought tolerant-were grown using the mixed cropping technique that results in close tangling of their root systems, hereinafter referred to "close mixed-planting". This technique improved the photosynthetic and transpiration rates of the upland crops subjected to flood stress ($O_2$-deficient nutrient culture). Oxygen transfer was suggested between the two plants mix-cultured in water, implying its contribution to the phenomenon that improved the physiological status of upland crops under the simulated flood stress. Secondly, we further tested whether this phenomenon would be expressed under field flood conditions. The effects of close mixed-planting of pearl millet and sorghum with rice on their survival, growth and grain yields were evaluated under controlled field flooding in semi-arid Namibia during 2014/2015-2015/2016. Single-stand and mixed plant treatments were subjected to 11-22 day flood stress at the vegetative growth stage. Close Mixed-planting increased seedling survival rates in both pearl millet and sorghum. Grain yields of pearl millet and sorghum were reduced by flooding, in both the single-stand and mixed plant treatments, relative to the non-flooded upland yields, but the reduction was lower in the mixed plant treatments. In contrast, flooding increased rice yields. Both pearl millet-rice and sorghum-rice mixtures demonstrated higher land equivalent ratios, indicating a mixed planting advantage under flood conditions. These results indicate that mix-planting pearl millet or sorghum with rice could alleviate flood stress on dryland cereals. The results also suggest that with this cropping technique, rice could compensate for the dryland cereal yield losses due to field flooding. Mixed cropping of wet and dryland crops is a new concept to overcome flood stress under variable environmental conditions.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2012.02a
• /
• pp.431-432
• /
• 2012

In the era of 20 nm scaled semiconductor volume manufacturing, Microelectronics Manufacturing Engineering Education is presented in this paper. The purpose of microelectronic engineering education is to educate engineers to work in the semiconductor industry; it is therefore should be considered even before than technology development. Three Microelectronics Manufacturing Engineering related courses are introduced, and how undergraduate students acquired hands-on experience on Microelectronics fabrication and manufacturing. Conventionally employed wire bonding was recognized as not only an additional parasitic source in high-frequency mobile applications due to the increased inductance caused from the wiring loop, but also a huddle for minimizing IC packaging footprint. To alleviate the concerns, chip bumping technologies such as flip chip bumping and pillar bumping have been suggested as promising chip assembly methods to provide high-density interconnects and lower signal propagation delay [1,2]. Aluminum as metal interconnecting material over the decades in integrated circuits (ICs) manufacturing has been rapidly replaced with copper in majority IC products. A single copper metal layer with various test patterns of lines and vias and $400{\mu}m$ by $400{\mu}m$ interconnected pads are formed. Mask M1 allows metal interconnection patterns on 4" wafers with AZ1512 positive tone photoresist, and Cu/TiN/Ti layers are wet etched in two steps. We employed WPR, a thick patternable negative photoresist, manufactured by JSR Corp., which is specifically developed as dielectric material for multi- chip packaging (MCP) and package-on-package (PoP). Spin-coating at 1,000 rpm, i-line UV exposure, and 1 hour curing at $110^{\circ}C$ allows about $25{\mu}m$ thick passivation layer before performing wafer level soldering. Conventional Si3N4 passivation between Cu and WPR layer using plasma CVD can be an optional. To practice the board level flip chip assembly, individual students draw their own fan-outs of 40 rectangle pads using Eagle CAD, a free PCB artwork EDA. Individuals then transfer the test circuitry on a blank CCFL board followed by Cu etching and solder mask processes. Negative dry film resist (DFR), Accimage$^{(R)}$, manufactured by Kolon Industries, Inc., was used for solder resist for ball grid array (BGA). We demonstrated how Microelectronics Manufacturing Engineering education has been performed by presenting brief intermediate by-product from undergraduate and graduate students. Microelectronics Manufacturing Engineering, once again, is to educating engineers to actively work in the area of semiconductor manufacturing. Through one semester senior level hands-on laboratory course, participating students will have clearer understanding on microelectronics manufacturing and realized the importance of manufacturing yield in practice.

• Korean Journal of Fisheries and Aquatic Sciences
• /
• v.14 no.4
• /
• pp.189-193
• /
• 1981

An apparatus for continuous measurements of sorption isotherm of dried food was manufactured to shorten the time required for equilibration. The apparatus was so designed that the temperature, air velocity and relative humidity in the experimental chamber could be controlled. The use of dynamic stream of conditioned air with a velocity of 0.2m/sec, instead of static atmosphere, allowed a faster equilibration of dried filefish muscle at $25^{\circ}C$. The mean time necessary for the equilibration of dried filefish muscle at the water activity of a given state to a higher water activity was about 45 hours. The monolayer moisture content of dried filefish muscle calculated from BET-equation was 0.092 kg water /kg dry matter at $25^{\circ}C$.