• Resources Recycling
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• v.19 no.1
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• pp.57-65
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• 2010

Recently, we have investigated the recovery of resources from the waste material of manufacturing printed circuit board. As printed circuit board or chip has become light, small, high reliability, it is necessary to reuse and recover resources from them. Especially, the printed circuit board that has been used for important mobile electronic pans are plated with min.0.03 ${\mu}m$ to max.50 ${\mu}m$. As increasing the cost of gold, raw material, chemicals, payments and waste material, it has been accelerated the competition for reuse and recovery. But, it is insufficiency of technician and equipments for the recovery of effective resource. In this paper, as analyzing the technical trend of gold recovery and waste back board from the manufacturing process of printed circuit board, it may be effective of recycling, further more it may be contributed to develop the valuable resources.

• Resources Recycling
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• v.10 no.6
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• pp.15-21
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• 2001

Shape-controlled copper oxides have been recovered from copper-containing waste etchant by neutralization with alkalihydroxide. Large amount of copper-containing waste etchant is generated from Printed Circuit Board industry. In an environmental and economic point of view, retrieve of the valuable natural resource from the waste is important. In recycling process of copper oxide from the waste etchant, reaction temperature controls shapes and sizes of the products. Copper oxide recovered below reaction temperature $40^{\circ}C$ was of a needle shape, while copper oxide comes in a platy shape above $40 ^{\circ}C$ . Physical properties of samples have been characterized using SEM, XRD, TGA and Atomic absorption spectroscopy.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.545-545
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• 2007

Recently, innovative process has been investigated in order to replace the conventional high-cost micro patterning processes on the electronic products. To produce desirable profit margins from this low cost products, printed circuit board(PCB), will require dramatic changes in the current manufacturing philosophies and processes. Innovative process using metal nano particles replaces the current industry standard of subtractive etched of copper as a highly efficient way to produce robust circuitry on low cost substrates. An advantage of using metal nano particles process in patterned conductive line manufacturing is that the process is additive. Material is only deposited in desired locations, thereby reducing the amount of chemical and material waste. Simply, it just draws on the substrate as glass epoxy or polyimide with metal nano particles. Particles, when their size becomes nano-meter scale, show some specific characteristics such as enhanced reactivity of surface atoms, decrease in melting point, high electric conductivity compared with the bulk. Melting temperature of metal gets low, the metal nano particles could be formated onto polymer substrates and sintered under $300^{\circ}C$, which would be applied in PCB. It can be getting the metal line of excellent electric conductivity.

• Resources Recycling
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• v.12 no.2
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• pp.3-10
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• 2003

Copper oxychloride used as an agricultural fungicide has been recovered from copper-containing waste etchant by the neutralization with alkali hydroxides. Large amount of copper-containing waste etchant is generated from Printed Circuit Board industry. In an environmental and economic point of view, retrieve of the valuable natural resource from the waste is important. Recycling process of copper oxychloride from the waste etchant is discovered through the our study. In the range of reaction temp. 2$0^{\circ}C$-4$0^{\circ}C$, pH 5-7, pure copper oxychloride was able to prepare and the yield of copper oxychloride was higher than 95%. Physical properties of the sample have been characterized using SEM, XRD, TGA, ICP and Atomic absorption spectroscopy.

• Resources Recycling
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• v.21 no.3
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• pp.56-64
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• 2012

It is generally well known that PCB (Printed Circuit Board) is an electric component assembled by various metals mixed with plastics and ceramics. Accordingly, it is very important to extract metallic components from used PCBs from the point of view of recycling of used resources as well as an environmental protection. In this paper, patents and paper on the recycling technologies of PCB were analyzed. The range of search was limited in the open patents of USA (US), European Union (EP), Japan (JP), Korea (KR) and SCI journals from 1980 to 2011. Patents and journals were collected using key-words searching and filtered by filtering criteria. The trends of the patents and journals was analyzed by the years, countries, companies, and technologies.

• Resources Recycling
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• v.26 no.4
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• pp.9-18
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• 2017

Recently, the amount of electronic scrap is rapidly increasing due to the rapid growth of the electronics industry. Among the components of electronic scrap, the printed circuit board(PCB) is an important recycling target which includes common metals, precious metals, and rare metals such as gold, silver, copper, tin, nickel and so on. In Korea, however, PCB recycling technologies are mainly commercialized by some major companies, and other process quantities are not accurately counted. According to present situation, several urban mining companies, research institutes, and universities are conducting research on recovery of valuable metals from PCBs and/or reusing them as raw materials that is different from existing commercialization process developed by major companies. In this study, we analyzed not only current status of collection/disposal process and recycling of waste PCBs in Korea but also the trend of recycling technologies in order to help resource circulation from waste PCBs become more active.

• Resources Recycling
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• v.14 no.5 s.67
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• pp.45-53
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• 2005

Electro-generated chlorine leaching of waste printed circuit boards was investigated in hydrochloric acid solutions. Non-magnetic component of $0.6{\sim}1.2mm$ was prepared by grinding, magnetic separation, and sieving. The non-magnetic component of pulverized printed circuit board contained about 45% of metal component, in which copper was about 83.6%. The leaching rate of copper was greatly affected by current density and agitation speed. The leaching of copper up to 98% was achieved at $20mA/cm^2$, $50^{\circ}C$, 180 minutes, and 600 rpm in 1M HCl solutions. Increasing agitation and lowering current density enhanced utilization efficiency of electro-generated chlorine. Leaching of copper was suppressed at the initial stage, while the minor metal elements, such as aluminum, lead, and tin, were dominantly leached out.

• Resources Recycling
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• v.26 no.4
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• pp.95-100
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• 2017

In this study, $Fe_2O_3$ was added as a flux to decrease melting temperature and refine during melting of Cu powder from scraped surface of the waste PCB (printed circuit board). The effect of $Fe_2O_3$ ratio to Cu powder and temperature on the recovery of Cu and content of impurities were investigated. It was found that the recovery of Cu was increased with increasing addition ratio of $Fe_2O_3$ and reaction temperature. The contents of O, Si and Fe in Cu phase were also decreased with increasing addition ratio of $Fe_2O_3$ and temperature. The formation of fayalite ($2FeO{\cdot}SiO_2$) and iron oxides phases in the slag was confirmed by XRD analysis after reaction with $Fe_2O_3$. Therefore, it was considered that the decrease of melting temperature and viscosity of slag by formation of fayalite slag contributed remarkably to the Cu recovery.

• Resources Recycling
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• v.22 no.4
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• pp.12-21
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• 2013

Waste electrical and electronic equipment(WEEE or E-waste) is one of the fastest growing waste stream in Korea. The proper management of such equipment has become of major concern for solid waste professionals because of the large growth of the waste stream and the presence of a myriad of toxic materials in it. In this paper, in order to evaluate the economical value of the recycling metallic materials from the E-waste, big size electrical home appliances, small size electrical home appliances, end of life hand phone and PCB(printed circuit board) were reviewed.

• Korean Chemical Engineering Research
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• v.52 no.2
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• pp.272-277
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• 2014

In this study the nanofiltration (NF) membrane treatment of a sulfuric acid waste solutions containing copper ion ($Cu^{+2}$) discharging from the etching processes of the printed circuit board (PCB) manufacturing industry has been studied for the recycling of acid etching solution. SelRO MPS-34 4040 NF membrane from Koch company was tested to obtain the basic NF data for recycling of etching solution and separation efficiency (total rejection) of copper ion. NF experiments were carried out with a cross-flow membrane filtration laboratory system. The permeate flux was decreased with the increasing copper ion concentration in sulfuric acid solution and lowering pH of acid solution, and its value was the range of $4.5{\sim}23L/m^2{\cdot}h$. Total rejection of copper ion was decreased with the increasing copper ion concentration, lowering pH of acid solution and decreasing cross-flow rate. The total rejection of copper ion was more than 70% at the experimental condition. The SelRO MPS-34 4040 NF membrane was represented the stable flux and rejection for 1 year operation.