• Title/Summary/Keyword: waste back board

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Recovery of Waste Back Board and Gold from the Process of Printed Circuit Board (인쇄회로기판(印刷回路基板) 제조공정(製造工程)의 폐(廢) Back Board 및 금(金) 회수(回收))

  • Kim, Yu-Sang
    • Resources Recycling
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    • v.19 no.1
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    • pp.57-65
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    • 2010
  • Recently, we have investigated the recovery of resources from the waste material of manufacturing printed circuit board. As printed circuit board or chip has become light, small, high reliability, it is necessary to reuse and recover resources from them. Especially, the printed circuit board that has been used for important mobile electronic pans are plated with min.0.03 ${\mu}m$ to max.50 ${\mu}m$. As increasing the cost of gold, raw material, chemicals, payments and waste material, it has been accelerated the competition for reuse and recovery. But, it is insufficiency of technician and equipments for the recovery of effective resource. In this paper, as analyzing the technical trend of gold recovery and waste back board from the manufacturing process of printed circuit board, it may be effective of recycling, further more it may be contributed to develop the valuable resources.

Heating Experiment of Fireproof Board using the Dry Process Bottom Ash and Oyster Shell (굴 패각과 건식공정 바텀애시를 사용한 내화보드의 가열실험)

  • Jung, Ui-In;Kim, Bong-Joo;Kim, Jin-Man
    • Journal of the Korea Institute of Building Construction
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    • v.16 no.3
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    • pp.193-199
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    • 2016
  • This study is a research about performance of fireproof board using industrial waste such as oyster shell and dry process bottom ash through the heating test and conclusions were obtained as follows. Test samples show back side temperatures as follows : in $300^{\circ}C$, $103.1{\sim}125.1^{\circ}C$, in $600^{\circ}C$, $201.1{\sim}210.1^{\circ}C$, in $900^{\circ}C$, $249.2{\sim}276.9^{\circ}C$. In the test, temperature increases of specimens of fireproof board are kept at certain temperatures hence it could be concluded that the specimens withstand high temperatures. According to the test, it could be concluded that fireproof board made by smaller particles shows better performance up to $600^{\circ}C$ while at higher temperatures, fireproof board made by bigger particles shows better performance. It is estimated that fireproof board made by particles of bigger size has more pore structure and it delays heat conduction.