• Journal of Mechanical Science and Technology
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• v.14 no.2
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• pp.251-258
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• 2000

Thermal deformation in an electronic package due to thermal strain mismatch is investigated. The warpage and the in-plane deformation of the package after encapsulation is analyzed using the laminated plate theory. An exact solution for the thermal deformation of an electronic package with circular shape is derived. Theoretical results are presented on the effects of the layer geometries and material properties on the thermal deformation. Several applications of the exact solution to electronic packaging product development are illustrated. The applications include lead on chip package, encapsulated chip on board and chip on substrate.

• Current Applied Physics
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• v.18 no.11
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• pp.1451-1457
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• 2018

Injection compression molding (ICM) is an advantageous processing method for producing thin and large polymeric parts in a robust manner. In the current study, we employed the ICM process for an energy-related application, i.e., thin and large polymeric battery case. A mold for manufacturing the battery case was fabricated using injection molding. The filling behavior of molten polymer in the mold cavity was investigated experimentally. To provide an in-depth understanding of the ICM process, ICM and normal injection molding processes were compared numerically. It was found that the ICM had a relatively low filling pressure, which resulted in reduced shrinkage and warpage of the final products. Effect of the parting line gap on the ICM characteristics, such as filling pressure, clamping force, filling time, volumetric shrinkage, and warpage, was analyzed via numerical simulation. The smaller gap in the ICM parting line led to the better dimensional stability in the finished product. The ICM sample using a 0.1 mm gap showed a 76% reduction in the dimensional deflection compared with the normal injection molded part.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.8
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• pp.5074-5081
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• 2015

A method for improving the warpage of the plastic part is a method of removing residual stress of the plastic product. that a non-uniform cooling are appeared in the injection molding process make uniform cooling. this study was developed the Rapid heating and cooling device used peltier module for uniform cooling. Make the Rapid heating and cooling device(RCHD), for Traditional water cooling device(TWCD) method and the Rapid heating and cooling method warpage were compared and were analyzed and the materials used amorphous ABS polymer. various warpage were compared for the process parameters such as packing pressure, packing time, resin temperature, mold temperature, In the amorphous ABS polymer, TWCD method has higher warpage than RCHD method and show the result to be a bit more uniform cooling. The distribution state of the ABS polymer was confirmed Through the Scanning electron microscope. In the TWCD method the distribution state of the polymer be densely distributed, and RCHS method be distributed wider than TWCD method. this is that injection molded parts be seen that cooling was made uniformly, As the temperature of the mold is gradually progress, Particles of the polymer is increased this is that internal stress was reduced.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.8 no.2
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• pp.53-59
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• 2009

The analysis of injection molding process by CAE is widely used in development of plastic products. That comes from the fact that CAE analysis can reduce trial and error based on optimized design. On this study, by use of MOLDFLOW, the causes of product defects were found and solved by trade-off study. CAE analysis includes Flow-Cool-Warpage Analyses and finally a new mold-die design with better product quality was suggested. On injection molding of round-shaped plastic fan, new mold-die system with 4-tunnel gates located on the edge of a fan disc shows better quality rather than pin-point gate located on the center of a disc. That was effective in terms of flow mark removal and flatness improvement of the product.

• Design & Manufacturing
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• v.12 no.2
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• pp.27-33
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• 2018

Korea's automobile industry, which has grown rapidly to become the world's fifth-largest automobile producer, To cope with environmental pollution and energy problems in order to prevail competitive edge in global market We are investing a lot of research personnel and costs. Among them, for realizing alternative light weight It is a part of the automobile module system that has achieved the technological development before the breakthrough in the injection molding process in the press process. Door module PNL was the subject of research. The door module PNL is expected to cause warpage before the mold production due to the thin and flat product characteristics and fiber orientation characteristic of the material. In this paper, CAE analysis and reverse correction tool Design. CAE analysis to obtain the results of weld line position, bending position and deformation value Through the correction tool, think3, the original product was modified before the mold production to improve the completeness of the parts. In fiber orientation, the position and size of the cooling channel in the mold, the position and size of the gate, Temperature, pressure, time, and work environment. Compared with the result of CAE analysis, the product that was reverse-corrected by Think3 was manufactured, and injection molding was performed. Injection molding products were tested 24 hours later. 3.5 mm to 7.0 mm, and under the fixed condition, the deviation was from 1.1 mm to 1.5 mm. Unlike the CAE analysis, the deviation of the actual injection pressure and the cooling temperature, the fiber orientation of the material, In order to solve this problem, it is necessary to compare the injection conditions with the database, I knew I had to catch the standard.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.4
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• pp.101-105
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• 2019

The adhesion reliability of the epoxy molding compound (EMC) and the printed circuit board (PCB) interface is critical to the quality and lifetime of the chip package since the EMC protects PCB from the external environment during the manufacturing, storage, and shipping processes. It is necessary to measure adhesion energy accurately to ensure product reliability by optimizing the manufacturing process during the development phase. This research deals with the measurement of EMC/PCB interfacial adhesion energy of chip package that has warpage induced by the coefficient of thermal expansion (CTE) mismatch. The double cantilever beam (DCB) test was conducted to measure adhesion energy, and the spring back force of specimens with warpage was compensated to calculate adhesion energy since the DCB test requires flat substrates. The result was verified by comparing the adhesion energy of flat chip packages come from the same manufacturing process.

• Polymer(Korea)
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• v.36 no.2
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• pp.131-136
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• 2012

Residual stress is developed in the injection molded articles during the molding process due to temperature variation and shear stress. The residual stress causes the deformation and warpage in the injection molded parts shortly within several days or after several years. Therefore, the injection molding conditions should be optimized to reduce the residual stress. And residual stress in the part should be also relaxed after molding process to maintain its shape. According to the annealing conditions, such as relative humidity, temperature and time, this study investigates the relaxation of residual stress generated in the transparent injection molded specimens. Through the experimental results, it was realized that the residual stress was relaxed at a relative humidity higher than 50%. Utilizing photoelasticity equipment, it was found that the residual stress was rapidly relaxed near glass transition temperature. Additionally, we recognized that the specimen shrunk along the flow direction but expanded to the perpendicular direction of the flow during the annealing processes, which resulted in the warpage of the specimen.

• Polymer(Korea)
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• v.38 no.6
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• pp.708-713
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• 2014

Most plastics products are being produced by injection molding process. However, mold shrinkage is inevitable in injection molding process and it deteriorates dimensional quality through deflections and warpages. Mold shrinkage depends upon the material property of resin as well as injection molding condition. In this study, material property of resin has been predicted for glass fiber reinforced polycarbonate to control the warpage, and computer simulation of injection molding has been performed using predicted property. It was observed that the deflection of part decreased by the glass fiber reinforced resin. In order to verify the validity of this method and confidence of results, experiments of injection molding were performed. The results of experiments and computer simulations showed good agreement in their tendency of deflections. Consequently, it was concluded that the method of designing the material property of resin conducted in this study can be utilized to control the dimensional accuracy of injection molded products.

• Design & Manufacturing
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• v.13 no.2
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• pp.1-5
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• 2019

In this study, micro cellular injection molding of automobile head lamp housing with uneven thickness structure was performed to obtain improvement on deformation and light-weight of the part. The thickness of the presented model was uniformly modified to control the deformation of the molded part. In order to maximize the lightweight ratio, the model having an average thickness of 2.0 mm were thinly molded to an average thickness of 1.6 mm. GFM(Gas Free Molding) and CBM(Core Back Molding) technology were applied to improve the problems of the conventional foam molding method. Equal Heat & Cool system was also applied by 3D cooling core and individual flow control system. Warpage of the molded parts with even cooling was minimized. To improve the mechanical properties of foamed products, complex resin containing nano-filler was used and variation of mechanical properties was evaluated. It was shown that the weight reduction ratio of products with light-weighted injection molding was 8.9 % and the deformation of the products was improved from the maximum of 3.6 mm to 2.0 mm by applying Equal Heat & Cool mold cooling system. Also the mechanical strength reduction of foamed product was less than 12% at maximum.

• Composites Research
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• v.27 no.4
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• pp.174-181
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• 2014

This study describes viscoelasticity analysis of carbon-fiber reinforced polymer matrix composite material. One of the most important problem during high temperature molding process is residual stress. Residual stress can cause warpage and cracks which can lead to serious defects of the final product. For the difference in thermal expansion coefficient and change of resin property during curing, it is difficult to predict the final deformed shape of carbon-fiber reinforced polymer matrix composite. The consideration of chemical shrinkage can reduce the prediction errors. For this reason, this study includes the viscoelasticity and chemical shrinkage effects in FE analysis by creating subroutines in ABAQUS. Analysis results are compared with other researches to verify the validity of the subroutine developed, and several stacking sequences are introduced to compare tested results.