• Design & Manufacturing
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• v.2 no.4
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• pp.54-61
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• 2008

Warpage, which is one of the molding trouble, acts as possible factor which results in defect in assembly. In this study, a mold was designed to produce specimens with rib parallel to flow direction, specimens with rib perpendicular to flow direction and specimens without rib. This work researched change of warpage according to injection molding condition such as injection pressure, packing pressure, packing time, resin temperature, mold temperature in non-crystalline resins(PC, ABS), crystalline resins(PP, PA66), and 30% glass fiber reinforced-resins(PC, ABS, PP, PA66).Specimens with rib and Crystalline resins show more warpage than specimens without rib and non-crystalline resins, respectively. Glass fiber reinforced-resins and specimens with rib parallel to flow direction show smaller warpage than conventional resins and specimens with rib perpendicular to flow, respectively. Specimens with rib and specimens without rib show reduced warpage as packing time increases. In addition, warpage increase as resin temperature increases. It is found that CAE shows similar tendency with experiment as packing time, resin temperature. when the rib is caused, warpage will reduce and prevent the transformation. product of a irregular form occurs warpage. In the study It'll be basic data that product occurs warpage, preferablity.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.09a
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• pp.126-131
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• 2005

In the present study, warpage characteristics of mobile phone cover through injection molding process were investigated by using design of experiments. Warpage in plastic injection molding process has a significant effect on quality of product. Effects of injection time, packing pressure, packing time, mold temperature ana melt temperature on warpage of mobile phone cover were considered by CAE analysis and experiment with Taguchi method. The degree of warpage for the injection molded product was measured by using three dimensional CMM. It was shown that temperature parameter has more significant effect on the warpage of mobile phone cover than pressure parameter.

• Smart Structures and Systems
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• v.29 no.6
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• pp.767-775
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• 2022

Metal additive manufacturing (AM), also known as metal three-dimensional (3D) printing, produces 3D metal products by repeatedly adding and solidifying metal materials layer by layer. During the metal AM process, products experience repeated local melting and cooling using a laser or electron beam, resulting in product defects, such as warpage, cracks, and internal pores. Such defects adversely affect the final product. This paper proposes the in situ monitoring-based warpage prediction of metal AM products with experimental feature extraction. The temperature profile of the metal AM substrate during the process was experimentally collected. Time-domain features were extracted from the temperature profile, and their relationships to the warpage mechanism were investigated. The standard deviation showed a significant linear correlation with warpage. The findings from this study are expected to contribute to optimizing process parameters for metal AM warpage reduction.

• Proceedings of the KSME Conference
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• 2000.04a
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• pp.741-744
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• 2000

In general there occur warpage in one way long part. Warpage is caused by differential shrinkage-Orientation Effect, Volumetric Shrinkage Effect, Differential Cooling Effect -over the part. Deco-Top is located at the top of 29"TV set and it's shape is one way long$(626{\times}130mm)$. Material is used transparency ABS resin. So we can't design ribs in this part. And we use film gate to avoid weld line. In these reasons we must develop no ribs and no warpage product. In this study we use MOLDFLOW's software-MF/FLOW, MF/COOL, MF/WARP. Using MF/FLOW, set the flow balance and gate positioning. And we can set cooling channel layout and the optimum processing condition through MF/COOL and MF/WARP. In result we reduced trials and obtained good product.

• Transactions of Materials Processing
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• v.17 no.6
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• pp.443-448
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• 2008

Fiber reinforced injection molded parts are widely used in recent years because of their improved properties of materials such as specific stiffness, specific strength, and specific toughness. The demand for products with high precision is increasing and it is important to minimize the warpage of the products. The warpage of short-fiber reinforced product is caused by anisotropy induced by fiber orientation as well as the residual stresses induced during the molding process. In order to reduce the warpage of the part, it is important to achieve successful mold design, processing control, and part design. In the present study, the design of gating system, molding condition, and part structure were carried out and verified with numerical analysis using a commercial CAE code Moldflow. The numbers and locations of gates were iteratively determined, and the molding conditions which can decrease the warpage of the part were investigated. Finally, slight structural modification of the part was conducted to reduce the locally concentrated warpage.

• Transactions of Materials Processing
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• v.15 no.1 s.82
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• pp.76-81
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• 2006

In this study, warpage characteristics of mobile phone cover through injection molding process were investigated using design of experiments in injection molding process. Warpage in plastic injection molding has a significant effect on quality of product. Effects of injection time, packing pressure, packing time, mold temperature and melt temperature on the warpage of mobile phone cover were considered by numerical analysis and experiment with Taguchi method. The degree of warpage for the injection molded part was measured by using three dimensional coordinate measurement machine. It was shown that temperature control factor has more significant effect on the warpage of mobile phone cover than pressure control factor.

• Journal of the Semiconductor & Display Technology
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• v.15 no.2
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• pp.1-5
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• 2016

3D printer is the equipment of the system for sequentially layer laminated in the materials. Now 3D printer used in various fields such as, semiconductor, electricity automobile, medical and various types of output method and material. In this paper, we studied about the improvement on warpage due to shrinkage of product from 3D printer of FDM(Fused Deposition Modeling) type, we proposed measures systematically to solve warpage problem using of 6SC(6 Step Creativity) method of practical TRIZ. After experimented with product prototypes experiment, we verified effect about solution.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.1
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• pp.31-39
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• 2014

For mobile application, semiconductor packages are increasingly moving toward high density, miniaturization, lighter and multi-functions. Typical wafer level packages (WLP) is fan-in design, it can not meet high I/O requirement. The fan-out wafer level packages (FOWLPs) with reconfiguration technology have recently emerged as a new WLP technology. In FOWLP, warpage is one of the most critical issues since the thickness of FOWLP is thinner than traditional IC package and warpage of WLP is much larger than the die level package. Warpage affects the throughput and yield of the next manufacturing process as well as wafer handling and fabrication processability. In this study, we investigated the characteristics of warpage and main parameters which affect the warpage deformation of FOWLP using the finite element numerical simulation. In order to minimize the warpage, the characteristics of warpage for various epoxy mold compounds (EMCs) and carrier materials are investigated, and DOE optimization is also performed. In particular, warpage after EMC molding and after carrier detachment process were analyzed respectively. The simulation results indicate that the most influential factor on warpage is CTE of EMC after molding process. EMC material of low CTE and high Tg (glass transition temperature) will reduce the warpage. For carrier material, Alloy42 shows the lowest warpage. Therefore, considering the cost, oxidation and thermal conductivity, Alloy42 or SUS304 is recommend for a carrier material.

• Transactions of Materials Processing
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• v.14 no.3 s.75
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• pp.269-276
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• 2005

The purpose of this research is the warpage reduction for intake-manifold which is made to the injection molding. Intake-manifold is assembling to ultra sonic welding after forming. Therefore deformation is influence on the performance and manufacture to intake-manifold product. Location and number of gates, filling time, mold temperature, packing time, packing pressure and cooling time are factors that affect the deformation of injection molding product. Therefore, the injection molding characteristics of intake-manifold and the estimated deformation are detected by CAE analysis and compare measuring data in this study.

• Journal of the Semiconductor & Display Technology
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• v.15 no.4
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• pp.1-9
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• 2016

The warpage on mobile phone camera packages occurs due to the CTE(Coefficient of Thermal Expansion) mismatch between a thin silicon die and a substrate. The warpage in the optical instruments such as camera module has an effect on the field curvature, which is one of the factors degrading the optical performance and the product yield. In this paper, we studied the effect of die bonding epoxy on the package and optical performance of mobile phone camera packages. We calculated the warpages of camera module packages by using a finite element analysis, and their shapes were in good agreement showing parabolic curvature. We also measured the warpages and through-focus MTF of camera module specimens with experiments. The warpage was improved on an epoxy with low elastic modulus at both finite element analysis and experiment results, and the MTF performance increased accordingly. The results show that die bonding epoxy affects the warpage generated on the image sensor during the packaging process, and this warpage eventually affects the optical performance associated with the field curvature.