• Journal of the Korean Society for Precision Engineering
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• v.18 no.12
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• pp.116-123
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• 2001

An automated injection molding design methodology has been developed to optimize multiple quality attributes, which are usually in conflict with each other, in injection molded parts. For the optimization, commercial CAE simulation tools and optimization techniques are integrated into the methodology. To decal with the multiple objective problem the relative closeness computed in TOPSIS(Technique for Order Preference by Similarity to Ideal Solution) is used as a performance measurement index for optimization multiple part defects. To attain robustness against process variation, Taguchi's quadratic loss function is introduced in the TOPSIS. Also, the modified complex method is used as an optimization tool to optimize objective function. The verification of the developed design methodology was carried out on simulation software with an actual model. Applied to production this methodology will be useful to companies in reducing their product development time and enhancing their product quality.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.4
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• pp.85-90
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• 2011

With regard to reliability of solder joint, the significant failures include open defects that occurs from alignment problem, Head in Pillow by PCB's warpage, the crack of solder by CTE mismatch, and the crack of IMC layer by mechanical impact. Especially as PCB down-sizing and surface finish is under progress, brittle failure of IMC layer between solder bump and PCB pad becomes a big issue. Therefore, it requires enhancing the level of difficulty in the existing assessment method and improving the measurement through the study on the mechanism of IMC formation, growth and brittle failure. Under this circumstance, this study is intended to suggest the direction of research for improving the reliability on the crack such as improvement of IMC brittle fracture.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.9
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• pp.3815-3821
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• 2012

The LCD frame is an important part which supports the BLU of medium/large sized TFT-LCD. To produce it efficiently, it is necessary to achieve the molding process improvement from 1 cavity to 2 cavity system. Because 2 cavity mold is compact and its hot-runner zone is broadened, it is difficult to control the temperature on the mold. In this study, injection molding analysis on the frame in 2 cavity process with FEA(Finite Element Analysis) software is carried out to estimate its quality. The calculated injection molding pressures and maximum deflection in 1 and 2 cavity processes are 41.13 MPa and 1.62 mm, 40.49 MPa and 1.66 mm respectively. The measured maximum flexure load and surface roughness of the left and right frame of 2 cavities are 209 N and 0.08 ${\mu}m$, 193 N and 0.10 ${\mu}m$ while those in 1 cavity are 140 N and 0.13 ${\mu}m$. Thermal image shows that the maximum standard deviation of the temperature on left and right side of 2 cavity mold is $1.23^{\circ}C$. The simulation and measurement results show that the quality of the frame in 2 cavity injection molding process as a whole is not worse than that of 1 cavity system. But maximum flexure loads of the frame in 2 cavity process are far greater than that in 1 cavity process.