• Proceedings of the Computational Structural Engineering Institute Conference
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• 1999.04a
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• pp.19-26
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• 1999

This paper deals with the stress singularity induced at the interface corner between the viscoelastic thin film and the rigid substrate as the film absorbs moisture from the ambient environment. The rime-domain boundary element method is employed to investigate the behavior of interface stresses. The order of the free-edge singularity is obtained numerically for a given viscoelastic model. It is shown that the free-edge stress intensity factor is relaxed with time,'while the order of the singularity increases with time for the viscoelastic model considered.

• Proceedings of the Computational Structural Engineering Institute Conference
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• 2003.10a
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• pp.389-394
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• 2003

In this study, the stress singularity factors generated during cooling down from high curing temperature to room temperature have been analyzed for the viscoelastic thin film. The time domain boundary element method has been employed to investigate the behavior of stresses for the whole interface. Within the context of a linear viscoelastic theory, a stress singularity exists at the point where the interface between the elastic substrate and the viscoelastic thin film intersects the free surface.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.11a
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• pp.137-142
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• 2002

This paper deals with the stress singularity induced at the interface corner between the elastic substrate and the viscoelastic thin film as the polymeric film absorbs moisture from the ambient environment. The boundary element method is employed to investigate the behavior of Interface stresses. The order of the singularity is obtained numerically for a given viscoelastic model. It is shown that the stress singularity factor is relaxed with time, while the order of the singularity increases with time for the viscoelastic model considered.

• Proceedings of the KOSOMBE Conference
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• v.1996 no.05
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• pp.164-166
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• 1996

Human aorta has viscoelastic behavior. The test of tissues such as aorta, skin, muscle, and ok. is required to consider visco effect on deformation behavior. Creep and slow recovery are main aspects of viscoelasticity of tissue engineering. Volumatric strain plays a important role in determine slow recovery of human arota. This study is to suggest the method avoiding viscous effect in tissue experiment The results shows the time scale when the specimen can be fully recovered from slow deformation. Also, this study observes the qualitative creep-effect on elastic strain in 1 minute at the same loading.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.1
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• pp.25-29
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• 2003

This paper deals with the stress singularity induced at the interface corner between the elastic substrate and the viscoelastic thin film as the polymeric film absorbs moisture from the ambient environment. The boundary element method is employed to investigate the behavior of interface stresses. The order of the singularity is obtained numerically for a given viscoelastic model. It is shown that the stress singularity factor is relaxed with time, while the order of the singularity increases with time for the viscoelastic model considered.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2000.04a
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• pp.167-170
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• 2000

The flexural vibration of a sandwich beam with partially inserted viscoelastic layer has been studied using the finite element analysis in combination with an experiment. Effects of length and thickness of partial viscoelastic layers on system loss factor(${\eta}_s$) and resonant frequency(${\omega}_r$) were considerably large. The thicker the viscoelastic layer in a sandwich beam, the larger the system loss factor in Mode 1 as compared with that in Mode 2. The loss factor increased almost linearly with increasing the length of partial viscoelastic layer. Effects of thickness of beams were also considered.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.1030-1035
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• 2003

The nanoimprint lithography technology makes higher density of semiconductor device and larger capacity of storage media. In this technology the induced damage while detaching polymer pattern from mold should be minimized. In order to analyze the problem, the basic knowledge of adhesion between the polymer and the mold is required. In this study a contact experiment of polyisobutylene specimen with spherical steel tip and polyisobutylene bead tip was conducted using nano indenter. During the contact experiment with various loading rate under load control the contact behavior of viscoelastic material was measured, i.e., the load and displacement between the tip and the specimen were measured. The data was analyzed by HBK model to obtain the stress intensity factor of contact edge and the contact radius as a function of time. Also the adhesion energies between steel/polyisobutylene and polyisobutylene/polyisobutylene were obtained employing the analysis of the crack of viscoelastic material by Schapery.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.24 no.3 s.174
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• pp.685-690
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• 2000

This paper deals with the stress singularity induced at the interface corner between the viscoelastic thin film and the rigid substrate as the film absorbs moisture from the ambient environment. Th e time domain boundary element method is employed to investigate the behavior of interface stresses. The order of the free-edge singularity is obtained numerically for a given viscoelastic model. It is shown that the stress singularity factor is relaxed with time, while the order of the singularity increases with time for the viscoelastic model considered.

• Structural Engineering and Mechanics
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• v.44 no.1
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• pp.1-13
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• 2012

In this paper the dynamic behavior of a viscoelastic Timoshenko beam subjected to a concentrated moving load are studied analytically and numerically. The viscoelastic properties of the beam obey the linear standard model in shear and incompressible in bulk. The governing equation for Timoshenko beam theory is obtained in viscoelastic form using the correspondence principle. The analytical solution is based on the Fourier series and the numerical solution is performed with finite element method. The effects of the material properties and the load velocity are investigated on the responses by numerical and analytical methods. In addition, the results are compared with the Euler beam results.

• Journal of Mechanical Science and Technology
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• v.18 no.1
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• pp.12-19
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• 2004

Using LSM (laser scanning method) , the radius of curvature due to thermal deformation in polyimide film coated on Si substrate is measured. Since the polyimide film shows viscoelastic behavior, i.e., the modulus and deformation of the film vary with time and temperature, we estimate the relaxation modulus and the residual stresses of the polyimide film by measuring the radius of curvature and subsequently by performing viscoelastic analysis. The residual stresses relax by an amount of 10％ at 100$^{\circ}C$ and 20% at 150$^{\circ}C$ for two hours.