• Title/Summary/Keyword: via holes

Search Result 139, Processing Time 0.028 seconds

Charge Transfer Mechanism of Electrically Bistable Switching Devices based on Polyimide

  • Lee, Gyeong-Jae;Im, Gyu-Uk;Kim, Dong-Min;Lee, Mun-Ho;Gang, Tae-Hui;Jeong, Seok-Min
    • Proceedings of the Korean Vacuum Society Conference
    • /
    • 2010.02a
    • /
    • pp.374-374
    • /
    • 2010
  • Charge transfer mechanism of poly(4,4'-aminotriphenylene hexafluoroisopropylidenediphthalimide) (TP6F PI) which exhibits bistable ON and OFF switching has been studied using photoemission electron spectroscopy (PES) and near-edge x-ray absorption fine structure (NEXAFS). Here, we demonstrate novel set-up in which holes are injected by photoemission process instead of direct charge carrier injection via metal electrode. The accumulated charges on the PI surface in the OFF state abruptly flow across the PI film when the bias voltage of a back electrode reaches a specific value, indicating that the film is changed to the ON state. Core level and x-ray absorption spectra probed at charge injection region via photoemission process do not show any evidences implying structural modification of TP6F PI during the phase change. Whereas, in valence band spectra, the highest occupied molecular orbital (HOMO) is shifted toward Fermi level, responsible for improved hole-mobility of TP6F PI of ON state.

  • PDF

Realization of High Impedance Surface Characteristics Using a Periodically Transformed Artificial Magnetic Conductor Structure and Reduction Technique of Specific Absorption Rate

  • Lee, Seungwoo;Rhee, Seung-Yeop;Kim, Pan-Yeol;Kim, Nam
    • Journal of electromagnetic engineering and science
    • /
    • v.13 no.2
    • /
    • pp.113-119
    • /
    • 2013
  • We developed a transformed, symmetrical, mushroom-like surface without via holes in cells focused on a 2.4-GHz WLAN band. Each slot in the novel type structure plays a key role in modeling at the desired frequencies. The designed artificial magnetic conductor (AMC) has several advantages, including a small size, a wider bandwidth, a short reflecting distance to the antenna, and easy fabrication because there are no via holes. Overall dimensions of the AMC cell are 21 mm $(Width){\times}21mm$ $(Height){\times}2.6mm$ (Thickness), and the bandwidth is about three times wider (11.7%) compared to that of a conventional AMC (4.0%). For evaluating the performance of the proposed structure, a reflector, which periodically consists of the designed AMC cells, was developed. The antenna with the investigated AMC reflector not only works within a quarter of the wavelength because of the extremely high wave impedance generated by the AMC cells on the surface of the structure but also reduces the specific absorption rate (SAR). Electromagnetic field (EMF) exposure to a human phantom was analyzed by applying the designed reflector to the 2.4-GHz dipole antenna in a tablet PC. The calculated peak SAR averaged over 1 g was 0.125 W/kg when the input power was 1 W and the antenna was located at 20 cm from the human phantom. However, the SAR value was only 0.002 W/kg (i.e., 98.4% blocked) when the designed reflector was inserted in front of the antenna.

Design of a Size-reduced Ring Hybrid Coupler Using an Artificial Dielectric Substrate (가유전체 기판을 이용한 소형화된 링 하이브리드 커플러의 설계)

  • Lim, Jongsik
    • Journal of the Korea Academia-Industrial cooperation Society
    • /
    • v.15 no.5
    • /
    • pp.3139-3145
    • /
    • 2014
  • This paper describes the design of a size-reduced ring hybrid coupler for microwave band using an artificial dielectric substrate(ADS). ADS structure adopts the second substrate on which has lots of the metalized via-holes. The effective capacitance and effective dielectric constant per unit length of ADS increases compared to the normal substrate due to the via-holes. This enables the physical length of microstrip transmission line to be reduced by adopting ADS instead of the normal substrate. In order to present an example of size-reduction of microwave wireless circuit by ADS, a size-reduced 3GHz ring hybrid coupler is designed, fabricated and measured in this work. The designed coupler has the smaller size from the normal one by 65% due to the ADS, while no critical degradation from ideal performances is observed. The measured power division ratio at two output ports are -3.05dB and -3.135dB, respectively. In addition, the phase differences are 3o for in-phase division and 176o for out of phase split. The measured performances are so similar to ideal ones, and prove the design of size-reduced ring hybrid coupler using ADS is successful.

Surface-Modified Porous Polymeric Membrane Using Vesicles

  • Im, Ji-Youn;Lee, Sang-Hee;Ko, Suck-Beom;Lee, Kuk-Haeng;Lee, Youn-Sik
    • Bulletin of the Korean Chemical Society
    • /
    • v.23 no.11
    • /
    • pp.1616-1622
    • /
    • 2002
  • If the surfaces of vesicles are chemically modified so that they can be dispersed in organic solvents, the application of vesicular colloids may be expanded. A polymerizable surfactant (BDAC) and nonpolymerizable bipolar surfactant (BPAS) were synthesized in multi-steps. Large vesicles composed of BDAC and BPAS with embedded a cross-linking agent (divinylbenzene) underwent a radical polymerization. BPAS was extracted out using methanol (skeletonization). The headgroup of BDAC was cleaved off via hydrolysis in an acidic condition to yield vesicles where surfaces were covered with -COOH groups. There was no significant change in the overall shape. The skeletonized vesicles appear to have many holes with diameters up to about 25 nm. The holes retained even after hydrolysis. The hydrolyzed vesicles were not dispersed in water and most organic solvents such as tetrahydrofuran and chloroform, but dispersed in methanol.

Spiral Waves and Shocks in Discs around Black Holes: Low Compressibility and High Compressibility Models

  • LANZAFAME GIUSEPPE;BELVEDERE GAETANO
    • Journal of The Korean Astronomical Society
    • /
    • v.34 no.4
    • /
    • pp.313-315
    • /
    • 2001
  • Some authors have concluded that spiral structures and shocks do not develop if an adiabatic index $\gamma$ > 1.16 is adopted in accretion disc modelling, whilst others have claimed that they obtained well defined spirals and shocks adopting a $\gamma$ = 1.2 and a $M_2/ M_1$ = 1 stellar mass ratio. In our opinion, it should be possible to develop spiral structures for low compressibility gas accretion discs if the primary component is a black hole. We considered a primary black hole of 8M0 and a small secondary component of 0.5M$\bigodot$ to favour spiral structures formations and possible spiral shocks via gas compression due to a strong gravitational attraction. We performed two 3D SPH simulations and two 2D SPH simulations and characterized a low compressibility model and a high compressibility model for each couple of simulations. 2D models reveal spiral structures existence. Moreover, spiral shocks are also evident in high compressibility 2D model at the outer disc edge. We believe that we could develop even well defined spiral shocks considering a more massive primary component.

  • PDF

Adaptive Call Admission Control Based on Spectrum Holes Prediction in Cognitive Radio Networks (인지라디오망의 스펙트럼홀 예측기반 적응 호수락제어기법)

  • Lee, Jin-yi
    • Journal of Advanced Navigation Technology
    • /
    • v.20 no.5
    • /
    • pp.440-445
    • /
    • 2016
  • There is a scheme where secondary users (SU) use predicted spectrum holes for primary users (PU) not to utilize for efficient utilization of the limited spectrum resources in cognitive radio networks. In this paper, we propose an adaptive call admission control framework that minimizes spectrum hopping call dropped probability (SHDP) for satisfying SU quality of service (QoS). The scheme is based on a call admission control (CAC), bandwidth prediction and adaptive bandwidth assignment. The prediction model predicts not only the number of spectrum holes, but requested bandwidth of SU spectrum hopping call, and then the CAC minimizes SHDP via an adaptive bandwidth assignment in resources not being enough for reservation. We bring Wiener prediction model to predict the resources. Simulations are conducted to compare the performance of proposed scheme with an existing, and show its ability of minimizing the SHDP.

Buckling analysis of perforated nano/microbeams with deformable boundary conditions via nonlocal strain gradient elasticity

  • Ugur Kafkas;Yunus Unal;M. Ozgur Yayli;Busra Uzun
    • Advances in nano research
    • /
    • v.15 no.4
    • /
    • pp.339-353
    • /
    • 2023
  • This work aims to present a solution for the buckling behavior of perforated nano/microbeams with deformable boundary conditions using nonlocal strain gradient theory (NLSGT). For the first time, a solution that can provide buckling loads based on the non-local and strain gradient effects of perforated nanostructures on an elastic foundation, while taking into account both deformable and rigid boundary conditions. Stokes' transformation and Fourier series are used to realize this aim and determine the buckling loads under various boundary conditions. We employ the NLSGT to account for size-dependent effects and utilize the Winkler model to formulate the elastic foundation. The buckling behavior of the perforated nano/microbeams restrained with lateral springs at both ends is studied for various parameters such as the number of holes, the length and filling ratio of the perforated beam, the internal length, the nonlocal parameter and the dimensionless foundation parameter. Our results indicate that the number of holes and filling ratio significantly affect the buckling response of perforated nano/microbeams. Increasing the filling ratio increases buckling loads, while increasing the number of holes decreases buckling loads. The effects of the non-local and internal length parameters on the buckling behavior of the perforated nano/microbeams are also discussed. These material length parameters have opposite effects on the variation of buckling loads. This study presents an effective eigenvalue solution based on Stokes' transformation and Fourier series of the restrained nano/microbeams under the effects of elastic medium, perforation parameters, deformable boundaries and nonlocal strain gradient elasticity for the first time.

Analysis of Crosstalk Reduction by Metal Filled Via Hole Fence in Bent Transmission Lines (구부러진 전송선에서 비아 홀 펜스에 의한 누화 감소 해석)

  • Kim Jong-Ho;Han Jae-Kwon;Park Dong-Chul
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
    • /
    • v.16 no.10 s.101
    • /
    • pp.1036-1042
    • /
    • 2005
  • The crosstalk between bent transmission lines and the effects of additional trace with the metal filled via holes on alleviating the crosstalk are investigated using the circuit concept approach for transmission line sections and impedance modeling for via hole sections. All sections are represented by ABCD matrices and then cascaded. Finally the calculated results by proposed method are confirmed that they agree with the measured results in less than 3 dB except a band of low frequency.

Empirical Model of Via-Hole Structures in High-Count Multi-Layered Printed Circuit Board (HCML 배선기판에서 비아홀 구조에 대한 경험적 모델)

  • Kim, Young-Woo;Lim, Yeong-Seog
    • Journal of the Institute of Electronics Engineers of Korea SD
    • /
    • v.47 no.12
    • /
    • pp.55-67
    • /
    • 2010
  • The electrical properties of a back drilled via-hole (BDH) without the open-stub and the plated through via-hole (PTH) with the open-stub, which is called the conventional structure, in a high-count multi~layered (HCML) printed circuit board (PCB) were investigated for a high-speed digital system, and a selected inner layer to transmit a high-speed signal was farthest away from the side to mount the component. Within 10 GHz of the broadband frequency, a design of experiment (DOE) methodology was carried out with three cause factors of each via-hole structure, which were the distance between the via-holes, the dimensions of drilling pad and the anti-pad in the ground plane, and then the relation between cause and result factors which were the maximum return loss, the half-power frequency, and the minimum insertion loss was analyzed. Subsequently, the empirical formulae resulting in a macro model were extracted and compared with the experiment results. Even, out of the cause range, the calculated results obtained from the macro model can be also matched with the measured results within 5 % of the error.

Cu Through-Via Formation using Open Via-hole Filling with Electrodeposition (열린 비아 Hole의 전기도금 Filling을 이용한 Cu 관통비아 형성공정)

  • Kim, Jae-Hwan;Park, Dae-Woong;Kim, Min-Young;Oh, Tae Sung
    • Journal of the Microelectronics and Packaging Society
    • /
    • v.21 no.4
    • /
    • pp.117-123
    • /
    • 2014
  • Cu through-vias, which can be used as thermal vias or vertical interconnects, were formed using bottom-up electrodeposition filling as well as top-down electrodeposition filling into open via-holes and their microstructures were observed. Solid Cu through-vias without voids could be successfully formed by bottom-up filling as well as top-down filling with direct-current electrodeposition. While chemical-mechanical polishing (CMP) to remove the overplated Cu layer was needed on both top and bottom surfaces of the specimen processed by top-down filling method, the bottomup process has an advantage that such CMP was necessary only on the top surface of the sample.