• The Journal of the Acoustical Society of Korea
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• v.43 no.3
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• pp.351-360
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• 2024

With the increasing use of drone technology, the Unmanned Aerial Vehicle (UAV) is now being utilized in various fields. However, this increased use of drones has resulted in various issues. Due to its small size, the drone is difficult to detect with radar or optical equipment, so acoustical tracking methods have been recently applied. In this paper, a method of localization of multiple drones using the acoustic characteristics of the quadcopter drone is suggested. Because the acoustic characteristics induced by each rotor are differentiated depending on the type of drone and its movement state, the sound source of the drone can be reconstructed by spatially clustering the results of the estimated positions of the blade passing frequency and its harmonic sound source. The reconstructed sound sources are utilized to finally determine the location of multiple-drone sound sources by applying the source localization algorithm. An experiment is conducted to analyze the acoustic characteristics of the test quadcopter drones, and the simulations for three different types of drones are conducted to localize the multiple drones based on the measured acoustic signals. The test result shows that the location of multiple drones can be estimated by utilizing the acoustic characteristics of the drone. Also, one can see that the clarity of the separated drone sound source and the source localization algorithm affect the accuracy of the localization for multiple-drone sound sources.

• Journal of Technology Innovation
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• v.26 no.3
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• pp.37-68
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• 2018

Since the 20th century, automobiles, which are the most common means of transportation, have been evolving as the use of electronic control devices and automotive semiconductors increases dramatically. Automotive semiconductors are a key component in automotive electronic control devices and are used to provide stability, efficiency of fuel use, and stability of operation to consumers. For example, automotive semiconductors include engines control, technologies for managing electric motors, transmission control units, hybrid vehicle control, start/stop systems, electronic motor control, automotive radar and LIDAR, smart head lamps, head-up displays, lane keeping systems. As such, semiconductors are being applied to almost all electronic control devices that make up an automobile, and they are creating more effects than simply combining mechanical devices. Since automotive semiconductors have a high data rate basically, a microprocessor unit is being used instead of a micro control unit. For example, semiconductors based on ARM processors are being used in telematics, audio/video multi-medias and navigation. Automotive semiconductors require characteristics such as high reliability, durability and long-term supply, considering the period of use of the automobile for more than 10 years. The reliability of automotive semiconductors is directly linked to the safety of automobiles. The semiconductor industry uses JEDEC and AEC standards to evaluate the reliability of automotive semiconductors. In addition, the life expectancy of the product is estimated at the early stage of development and at the early stage of mass production by using the reliability test method and results that are presented as standard in the automobile industry. However, there are limitations in predicting the failure rate caused by various parameters such as customer's various conditions of use and usage time. To overcome these limitations, much research has been done in academia and industry. Among them, researches using data mining techniques have been carried out in many semiconductor fields, but application and research on automotive semiconductors have not yet been studied. In this regard, this study investigates the relationship between data generated during semiconductor assembly and package test process by using data mining technique, and uses data mining technique suitable for predicting potential failure rate using customer bad data.