• Applied Microscopy
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• v.45 no.3
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• pp.119-125
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• 2015

Two-dimensional (2D) transition metal dichalcogenides (TMDCs) have attracted significant attention due to their unique and exotic properties attributed to their low dimensionality. In particular, semiconducting 2D TMDCs such as $MoS_2$, $WS_2$, $MoSe_2$, and $WSe_2$ have been demonstrated to be feasible for various advanced electronic and optical applications. In these regards, process to synthesize high quality 2D TMDCs layers with high reliability, wafer-scale uniformity, controllable layer number and excellent electronic properties is essential in order to use 2D TMDCs in practical applications. Vapor deposition techniques, such as physical vapor deposition, chemical vapor deposition and atomic layer deposition, could be promising processes to produce high quality 2D TMDCs due to high purity, thickness controllability and thickness uniformity. In this article, we briefly review recent research trend on vapor deposition techniques to synthesize 2D TMDCs.

• 한국연소학회:학술대회논문집
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• 2001.06a
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• pp.75-81
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• 2001

MCVD(modified chemical vapor deposition) used in making optical-fiber currently utilizes the hydrogen-oxygen burner as a energy supply source. To improve the productivity and to reduce the manufacturing cost of optical-fiber, a natural gas-oxygen burner has been developed. The manufacturing processes of optical-fiber consist of vapor deposition, collapse and drawing processes. Among these processes, the vapor deposition and the collapse processes are important in terms of improving the productivity and saving the production cost. The vapor deposition and collapse processes are performed by combustion heat and flame force supplied by a burner. So the flame force of the burner used in these processes is required to have an optimal and consistent value in order to allow uniform heating and collapse of quartz tube. In this regard, the momentum ratio of natural gas and oxygen has been optimally determined by modification of a burner and the inlet flow pass also has been modified.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.4
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• pp.481-488
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• 2004

Laser chemical vapor deposition can be used as a new approach for a rapid prototyping technique. The purpose of the study is to fabricate several 3-dimensional objects that are relatively simple as well as to find the characteristics of SiC rod growth that is the first step in developing a new rapid prototyping technique with laser chemical vapor deposition. In the study, SiC rods were generated with varying precursor pressure for 5 minutes. Deposition rates with varying precursor pressure, shapes of rods, surface roughness and component organization were investigated, in particular. Finally, several simple objects like a branch or a propeller were successfully fabricated using laser chemical vapor deposition.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.29 no.1 s.232
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• pp.14-21
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• 2005

Laser chemical vapor deposition can be an effective technique for a rapid prototyping with ceramic materials, in particular. The objective of the study is to fabricate several 3-dimensional objects by stacking multi-layers as well as to find out some basic aspects of a rapid prototyping with laser chemical vapor deposition such as deposition characteristics with traversing speed of the laser, possible problems in stacking multi-layers etc. The limit speed of the laser that can grow a tilted SiC rod was found in this study, and laser directing writing that occurs over the limit speed was also investigated. Finally, a zigzag-shaped rod, a spiral-shaped rod, a wall and a square duct were successfully fabricated with laser chemical vapor deposition of tetramethylsilane

• Journal of the Korean Vacuum Society
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• v.9 no.4
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• pp.394-399
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• 2000

The effects of the type and thickness of underlayer on the crystallographic texture and the sheet resistance of aluminum thin film were studied. Ti and Ti/TiN were examined as the underlayer of aluminum. Ti and TiN were prepared by ionized physical vapor deposition (I-PVD) metalorganic chemical vapor deposition (MOCVD), respectively. The texture and the sheet resistance of metal thin film stacks were investigated at various thicknesses of Ti or TiN, and the sheet resistance was measured after annealing at $400^{\circ}C$ in an nitrogen ambient. For I-PVD Ti underlayer, the excellent texture of aluminum <111> was obtained even at top of 5 nm of Ti. However, the sheet resistance of the metal stack was greatly increased after annealing due to the interdiffusion and reaction of Al and Ti. MOCVD TiN between Ti and Al could suppress the Al-Ti reaction without severe degradation of aluminum <111> texture. Excellent texture of aluminum was obtained for the MOCVD TiN thinner than 4 nm.

• Transactions of the Korean Society of Mechanical Engineers
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• v.18 no.1
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• pp.193-202
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• 1994

A study of heat transfer and particle deposition has been made numerically for outside vapor deposition process. Heat conduction through the two layer cylinder which consists of the target and the deposited layer is included together with heat transfer and gas jet flow onto the cylinder from the torch. Temperature and flow fields have been obtained by an iterative method and thermophoretic particle deposition has been studied. Of particlar interests are effects of the thickness of the deposited layer, the torch speed and the rotation speed of the cylinder on particle deposition flux and efficiency. Effects of buoyancy, variable properties and tube rotation are included.

• Transactions of the Korean Society of Mechanical Engineers
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• v.19 no.11
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• pp.3063-3071
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• 1995

An experimental study has been carried out for the heat transfer and particle deposition during the Outside Vapor Deposition process. The surface temperatures of deposited layers, and the rates, efficiencies and porosities of particle deposition were measured. It is shown that the axial variation of the surface temperature can be assumed to be quasi-steady and that as the traversing speed of burner is increased, the deposition rate, efficiency and porosity increase due to the decreased surface temperature. As the flow rate of the chemicals is increased, both the thickness of deposition layers and the surface temperature increase. Deposition rate also increases, however, deposition efficiency decreases for tests done. Later passes in early deposition stage result in higher surface temperatures due to increased thickness of porous deposited layers, which cause the deposition rate, efficiency, and porosity to decrease.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.26 no.9
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• pp.1226-1233
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• 2002

The purpose of the present study was to examine some basic aspects of laser chemical vapor deposition that will be ultimately utilized for solid freeform fabrication of three dimensional objects. Specifically, deposition of silicon carbide (SiC) using tetramethylsilane (TMS) as precursor was studied for a rod grown by $CO_2$laser-assisted chemical vapor deposition. First, temperature distribution for substrate was analyzed to select proper substrate where temperature was high enough for SiC to be deposited. Then, calculations of chemical equilibrium and heat and mass flow with chemical reactions were performed to predict deposition rates, deposit profiles, and deposit components. Finally, several rods were experimentally grown with varying chamber pressure and compared with the theoretical results.

• Journal of the Korean Society for Heat Treatment
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• v.34 no.5
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• pp.239-244
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• 2021

Following Silicon Carbide, single crystal diamond continues to attract attention as a next-generation semiconductor substrate material. In addition to excellent physical properties, large area and productivity are very important for semiconductor substrate materials. Research on the increase in area and productivity of single crystal diamonds has been carried out using various devices such as HPHT (High Pressure High Temperature) and MPECVD (Microwave Plasma Enhanced Chemical Vapor Deposition). We hit the limits of growth rate and internal defects. However, HFCVD (Hot Filament Chemical Vapor Deposition) can be replaced due to the previous problem. In this study, HFCVD confirmed the distance between the substrate and the filament, the accompanying growth rate, the surface shape, and the Raman shift of the substrate after vapor deposition according to the vapor deposition temperature change. As a result, it was confirmed that the difference in the growth rate of the single crystal substrate due to the change in the vapor deposition temperature was gained up to 5 times, and that as the vapor deposition temperature increased, a large amount of polycrystalline diamond tended to be generated on the surface.

• Bulletin of the Korean Chemical Society
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• v.27 no.10
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• pp.1633-1637
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• 2006

We demonstrate a selective vapor-phase deposition of conductive poly(3,4-ethylenedioxythiophene) (PEDOT) thin films on patterned $FeCl_3$. The PEDOT thin films were grown on various substrates by using the vapor-phase polymerization of ethylenedioxythiophene (EDOT) with $FeCl_3$ catalytic layers at 325 K. The selective deposition of the PEDOT thin films using vapor-phase polymerization was accomplished with patterned $FeCl_3$ layers as templates. Microcontact printing was done to prepare patterned $FeCl_3$ on polyethyleneterephthalate (PET) substrates. The selective vapor-phase deposition is based on the fact that the PEDOT thin films are selectively deposited only on the regions exposing $FeCl_3$ of the PET substrates, because the EDOT monomer can be polymerized only in the presence of oxidants, such as $FeCl_3$, Fe($CIO_4$), and iron(II) salts of organic acids/inorganic acids containing organic radicals.