• Plant Biotechnology Reports
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• 제5권3호
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• pp.217-224
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• 2011

Non-heading Chinese cabbage (Brassica rapa L. ssp. chinensis) is a popular vegetable in Asian countries. The diamondback moth (DBM), Plutella xylostella (L.), an insect with worldwide distribution, is a main pest of Brassicaceae crops and causes enormous crop losses. Transfer of the anti-insect gene into the plant genome by transgenic technology and subsequent breeding of insect-resistant varieties will be an effective approach to reducing the damage caused by this pest. We have produced transgenic non-heading Chinese cabbage plants expressing the potato proteinase inhibitor II gene (pinII) and tested the pest resistance of these transgenic plants. Non-heading Chinese cabbages grown for 45 days on which buds had formed were used as experimental materials for Agrobacterium-mediated vacuum infiltration transformation. Forty-one resistant plants were selected from 1166 g of seed harvested from the infiltrated plants based on the resistance of the young seedlings to the herbicide Basta. The transgenic traits were further confirmed by the Chlorophenol red test, PCR, and genomic Southern blotting. The results showed that the bar and pinII genes were co-integrated into the resistant plant genome. A bioassay of insect resistance in the second generation of individual lines of the transgenic plants showed that DBM larvae fed on transgenic leaves were severely stunted and had a higher mortality than those fed on the wild-type leaves.

• Composites Research
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• 제35권1호
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• pp.47-51
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• 2022

전자기기 발열을 효율적으로 제어하기 위해 열전도성 복합재료에 대한 많은 연구가 진행되고 있다. 본 연구에서는 solvent 별 분산에 따른 carbon fiber의 배열성 관계를 알아보기 위해 Milled Carbon Fiber를 4가지 Solvent에 분산하고 Vacuum filtration 방법을 통해 탄소섬유강화 복합재료(CFRP)를 제작하였다. CFRP의 배열성을 알아보기 위해 광학현미경 관측과 섬광법을 통한 열전도도를 측정하였다. NMP와 Ethanol을 Solvent로 사용하여 성형한 CFRP의 평면두께방향 열전도도가 각각 10.79 W/mK, 10.57 W/mK 값을 보였고 이는 평면내부방향 열전도도에 비해 218%, 209% 향상된 결과를 보였다. Solvent의 상대적으로 높은 점도 값은 solvent 유체의 높은 전단력에 영향을 주어 성형 시 필러의 배열성을 결정하는데 영향을 주는 것으로 판단된다.

• 한국진공학회지
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• 제7권s1호
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• pp.57-77
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• 1998

Heteroepitaxial $Y_2O_3$ films were grown on a Si(111) substrate by ionized cluster beam deposition(ICBD) in ultra high vacuum, and its qualities such as crystllitnity, film stress, and morphological characteristics were investigated using the various measurement methods. The crystallinity was investigated by x-ray diffraction (XRD) and reflection high energy electron diffraction (RHEED). Interface crystallinity was also examined by Rutherford backscattering spectroscopy(RBS) channeling, transmission electron microscopy(TEM). The stress of the films was measured by RBS channeling and XRD. Surface and interface morphological characteristics were investigated by atomic force microscopy (AFM) and x-ray scattering method. Comparing the interface with the surface characteristics, we can conclude that many defects at the interface region were generated by interface reaction between the yttrium metal and SiO2 layer and by ion beam characteristic such as shallow implantation, so that they influenced the film qualities. The film quality was dominantly depended on the characteristic temperature range. In the temperature range from $500^{\circ}C$ to $600^{\circ}C$, the crystallinity was mainly improved and the surface roughness was drastically decreased. On the other hand, in the temperature range from $600^{\circ}C$ to $700^{\circ}C$, the compressive stress and film density were dominantly increased, and the island size was more decreased. Also the surface morphological shape was transformed from elliptical shape to triangular. The film stress existed dominantly at the interface region due to the defects generation.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2009년도 춘계학술대회 논문집
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• pp.57-60
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• 2009

The conductive coating method was used for a various industrial fields. For example, Sputtering process is using to a coat of ITO layer in LCD or OLED panel manufacture process and fabricate a base layer of substrate of an electric printing device. However, conventional coating process (beam sputtering, spin coating etc.) has a problems in the industrial manufacturing process. These processes have a very high cost and critical manufacturing environment as a vacuum process. Recently, many researchers were proposed a various printing process instead of conventional coating process. In this paper, we propose an ESD printing process in ITO coating layer and apply to fabricate a conductive coating film. Ours transparent electrode had a surface resistance of about $66{\Omega}/{\square}$ and transparent of 74% in the wavelength of 500nm. This transparent electrode manufacturing process will be applied to Roll-to-Roll process. In addition, we developed roll printing process system for the next generation flexible solar cell.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 추계학술대회 논문집
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• pp.599-602
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• 2002

A novel rapid prototyping (RP) process, an automated transfer type variable lamination manufacturing process (Automated VLM-ST) has been developed. In Automated VLM-ST, a vacuum chuck and linear moving system transfer the plate type material with two pilot holes to the rotation stage. A four-axis synchronized hotwire cutter cuts the material twice to generate Automated Unit Shape Layer (AUSL) with the desired width, side slopes, length, and two reference shapes in accordance with CAD data. Each AUSL is stacked on the stacking plate with two pilot pins using the pilot holes in AUSL and the pilot pins. Subsequently, adhesive is supplied to the top surface of the stacked AUSL by a bonding roller and pressure is simultaneously applied to the bottom surface of the stacked AUSL. Finally, three-dimensional shapes are rapidly fabricated. This paper describes the procedure for generating the cutting path data (AUSL data) f3r automated VLM-ST. The method for the generation of the Automated Unit Shape Layer (AUSL) in Automated VLM-ST was practically applied and fabricated for a various shapes.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 영호남 합동 학술대회 및 춘계학술대회 논문집 센서 박막 기술교육
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• pp.41-45
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• 2006

The study on laser-ablation plasmas has been strongly interested in fundamental aspects of laser-solid interaction and consequent plasma generation. In particular, this plasma has been widely used for the deposition of thin solid films and applied to the semiconductors and insulators. In this paper, we developed and discussed the generation of carbon ablation plasmas emitted by laser radiation on a solid target, graphite. The progress of carbon plasmas by laser-ablation was simulated using Monte-Carlo particle model under the pressures of vacuum, 1 Pa, 10 Pa and 66 Pa. At the results, carbon particles with low energy were deposited on the substrate as the pressure becomes higher. However, there was no difference of deposition distributions of carbon particles on the substrate regardless of the pressure.

• Journal of Acupuncture Research
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• 제26권6호
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• pp.101-110
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• 2009

Objectives : We developed and proposed a guideline for safety and performance assessment of electric cupping apparatus(Class 2 medical device). Methods : We drafted the guideline for safety and performance assessment of electric cupping apparatus by referring the existing standards and guideline, based on online questionnaire for Korean medical doctors and measurement data from commercially available products. Physical dimension of cups and inner vacuum pressure were acquired for the measurement in order to achieve the purposes. Results : This guideline only can be applied to electric cupping apparatus for enhancing blood circulation by employing negative pressure generated by electricity. Seven items of appearance and label, operation test of pump, variation test of input electricity, vacuum level test, vacuum sustain test, cup-size dependent test, noise level test are suggested for evaluation subjects and methods required for electric cupping devices. Requirements for the design and development of electric cupping devices are suggested: vacuum level indicator, vacuum generation rate, pressure control, valve detachment stability, cup comparability, safety measure, surge protection, user friendliness, instruction for use (IFU). Conclusions : We proposed a guideline for safety and performance assessment of electric cupping apparatus to improve the quality of relating products and aid the commercialization of them, by aiming higher industrial competitiveness of the medical device sectors in Korea. Discussion with related institutes such as industry, academy and government is further required. Public hearings also need to be held prior to the establishment of a final guideline and standard.

• 한국진공학회지
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• 제13권4호
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• pp.139-144
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• 2004

최근에는 진공공정에서 용기내의 청정도와 잔류기체의 부분압에 대한 관심이 높아지고 있다. 본 연구에서는 청정진공 발생에 많이 사용되고 있는 크라이오 펌프의 냉각판 온도에 따른 $H_2$, He, C, N, $O_2$, $H_2O$, Ar/2, $N_2$(CO), Ar, $CO_2$의 부분압을 잔류기체분석기로 측정하여 비교하였다. 크라이오 펌프를 켜고 약 72분이 지났을 때 펌프의 냉각판 온도가 12K에 도달하였으며, 25시간이 경과하여 온도가 충분하게 낮아졌을 때 부분압은 $H_2$, He, C, N, $O_2$, $H_2O$, Ar/2, $N_2$, Ar, $CO_2$순으로 24.9%, 6.6%, 5.5%, 2.2%, 3.8%, 30.7%, 6.5%, 6.1%, 5.5 %, 8.2%로 $H_2$와 $H_2O $압력이 상대적으로 높은 것을 알 수 있었다.

• Korean Chemical Engineering Research
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• 제51권3호
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• pp.358-363
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• 2013

순수한 리튬-암모니아(Li-$NH_3$) 솔루션의 생성은 진공 상태에서 가능하지만, 고효율 열전전력을 얻기 위한 안정적이고 신뢰성 있는 분해에 대한 문제가 아직 남아있다. 본 논문은 Li-$NH_3$ 솔루션의 열전변환 효율을 향상시키기 위한 새로운 방법을 다루었다. 제안된 방법은 Li-$NH_3$ 솔루션의 합성과 분해를 위해 'U' 형태의 파이렉스 진공 튜브를 사용하였다. 튜브 상부에는 기존 'U' 형태의 파이렉스 진공 튜브의 두 다리를 연결하는 기체의 이동통로가 있는데, 이는 고온부(Hot side)에서 분해가 진행될 때 $NH_3$ 기화에 따른 양단의 내부압력 불균형을 방지하는 역할을 한다. 열전 실험결과, 'U' 형태 튜브 속에서 솔루션 반응은 기존 'U' 형태에 비해 매우 안정적이고 효율적으로 이루어졌으며, 결과적으로 열전변환 효율이 향상됨을 보였다. 또한, 제안 방식은 장시간에 걸친 고효율 열전 발전을 위해 튜브 속에서 합성과 분해가 순환되는 가역반응을 제공함이 입증되었다.

• 반도체디스플레이기술학회지
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• 제21권3호
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• pp.74-79
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• 2022

In this study, the plasma corrosion resistance and the change in the number of contamination particles generated using the plasma etching process and cleaning process of coating parts for semiconductor plasma etching equipment were investigated. As the coating method, atmospheric plasma spray (APS) was used, and the powder materials were Y₂O₃ and Y₃Al₅O₁₂ (YAG). There was a clear difference in the densities of the coatings due to the difference in solubility due to the melting point of the powdered material. As a plasma environment, a mixed gas of CF₄, O₂, and Ar was used, and the etching process was performed at 200 W for 60 min. After the plasma etching process, a fluorinated film was formed on the surface, and it was confirmed that the plasma resistance was lowered and contaminant particles were generated. We performed a surface cleaning process using piranha solution(H₂SO₄(3):H₂O₂(1)) to remove the defect-causing surface fluorinated film. APS-Y₂O₃ and APS-YAG coatings commonly increased the number of defects (pores, cracks) on the coating surface by plasma etching and cleaning processes. As a result, it was confirmed that the generation of contamination particles increased and the breakdown voltage decreased. In particular, in the case of APS-YAG under the same cleaning process conditions, some of the fluorinated film remained and surface defects increased, which accelerated the increase in the number of contamination particles after cleaning. These results suggest that contaminating particles and the breakdown voltage that causes defects in semiconductor devices can be controlled through the optimization of the APS coating process and cleaning process.