• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.160-163
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• 2002

Micro via hole Fabrication is studied by means of minimizing method to circuit size as many electric products developed to portable and minimize. Most of currently micro via hole fabrication using laser is that fabricate insulator layer using CO2 Laser after Cu layer by etching, or fabricate insulator layer using IR after trepanning Cu by UV. In this paper, it was performed that a metal layer and insulator layer were worked upon only one UV laser, and increase to processing speed by experiment.

• Laser Solutions
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• v.15 no.4
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• pp.16-19
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• 2012

Due to the fact that the dimensions of circuit lines of IC substrates have been forecast to reduce rapidly, engraving the circuit line patterns with laser has emerged as a promising alternative. To engrave circuit line patterns in an IC substrate, we used a projection ablation technique in which a metal (INVAR) mask and a DPSS UV laser instead of an excimer laser are used. Results showed that the circuit line patterns engraved in the IC substrate have a width of about 15um and a depth of $13{\mu}m$. This indicates that the projection ablation with a metal mask and a DPSS UV laser could feasibly replace the semi-additive process (SAP).

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.11a
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• pp.303-304
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• 2008

• Journal of the Korean Society for Precision Engineering
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• v.24 no.4 s.193
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• pp.147-152
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• 2007

UV laser ablation of polyimide is a combination of photochemical and photothermal mechanism. Photochemical mechanism is that molecular bonds are broken by photon energy and photothermal is evaporation and melt expulsion. When the laser processing, the etching depth needs to be calculated for prediction of processing result. In this paper, in order to predict the laser etching depth of polyimide by UV laser with the wavelength of 355nm, the theoretical model which includes both the photothermal and the photochemical effect was introduced. The model parameters were obtained by comparing with experimental results. The 3rd harmonic $Nd:YVO_4$ laser system was used in the experiment. From these experimental and theoretical results, the laser ablation of a polyimide was verified to achieve the highest quality microstructure.

• Laser Solutions
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• v.8 no.1
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• pp.9-18
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• 2005

The laser direct writing method using a UV Argon-ion laser is studied for fabrication of waveguide. The laser direct writing system is constructed with a vision camera, a xy-stage, a motion controller and the delivery components of a laser beam. The UV Argon-ion laser has wavelength range of $333.6\~363.8$ nm. A photo-active UV curable polymer for a planar light-wave circuit(PLC) of single mode is used. This polymer is irradiated by Argon-ion laser and developed by a solvent after a post-baking. The optimum laser direct writing condition is obtained experimentally by changing various process parameters such as laser power, writing speed and focal length. The propagation and coupling loss of a optical waveguide was measured as 1dB/cm and 0.6dB/cm, respectively. Also, the minimum width of waveguide of $100{\mu}m$(ZPLW-207) is obtained. Finally, the waveguides of line, bend and branch type are successfully fabricated.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.21 no.5
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• pp.773-777
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• 2012

Recently UV laser micromachining processes is widely introduced to meet the needs of advanced components of IT, BT and ET industries. Due to the characteristics of non-contact and high-speed laser processing, UV laser micromachining is applied to manufacture very thin substrate such as polymer, metals and composite. These minimum line width obtained by UV laser micromachining is generally determined from laser wavelength, optical lens and its numerical aperture. In this paper we will show the lens effect of water droplet on the surface of workpiece to reduce the line width when UV laser light is irradiated and focused through the water droplet. Because of the refraction effect generated by the semi-spherical or spherical shape of water droplet, we can find smaller line width. And water droplet could not only protect thermal deformation, but also carry away burr around micro dent. Firstly fundamental theory of minimum line width was derived from relationship between the geometry of water droplet and laser light trace, and then experimental and simulation results will be finally compared to verify the effectiveness of water droplet lens effect of UV laser micromachining process.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.608-611
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• 2003

In this paper, laser direct micromaching is developed to fabricate micro patterns using UV laser ( λ$_3$= 355 nm). Experimentally, laser beam paths mainly influences the surface shape quality. Thus. we proposed laser beam path generator by extracting shape data in a blueprint worked through CAD modeler and using genetic algorithm that considers the characteristics of laser beam. The results show that various shapes of micro patterns could be manufactured using proposed method in this paper.

• Laser Solutions
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• v.14 no.1
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• pp.14-18
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• 2011

Semiconductor industry demands decrease in line/space dimensions of IC substrates. Particularly for IC substrates for CPU, line/space dimensions below $10{\mu}m/10{\mu}m$ are expected to be used in production since 2014. Conventional production technologies (SAP, etc.) based on photolithography are widely agreed to be reaching capability limits. To address this limitation, the embedded circuit fabrication technology using laser ablation has been recently developed. In this paper, we used a nanosecond UV laser and a picosecond UV laser to fabricate embedded circuit patterns into a buildup film with $SiO_2$ powders for IC substrate. We conducted SEM and EDS analysis to investigate surface quality of the embedded circuit patterns. Experimental results showed that due to higher recoil pressure, picosecond UV laser ablation of the buildup film generated a better surface roughness.

• Laser Solutions
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• v.10 no.2
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• pp.17-24
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• 2007

We have studied a laser direct writing lithography(LDWL). This is more important to apply to micro patterning using UV laser. We demonstrate the possibility of LDWL and construct the fabrication system. We use Galvano scanner to process quickly micro patterns from computer data. And laser beam is focused with $F-{\theta}$ lens. AZ5214 and SU-8 photoresist are chosen as experimental materials and a kind of well-known positive and negative photoresist respectively. Laser ablation mechanism depends on the optical properties of polymer. In this paper, therefore we investigate the phenomenon of laser ablation according to the laser fluence variation and measure the shape profile of micro patterned holes. From these experimental results, we show that LDWL is very useful to process various micro patterns directly.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.731-732
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• 2010