• Transactions of the Korean Society of Mechanical Engineers A
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• v.29 no.4 s.235
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• pp.624-631
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• 2005

A note-book PC has become thinner in recent years, which requires the optical disc drives with small height and high memory capacity. Therefore the actuator of optical disc drives must be thinner and have disc tilt compensation function for high density memory. In this paper, the actuator with hybrid type is investigated for 3-axis ultra-slim actuator. A 3-axis ultra-slim actuator is designed by using the modal analysis of the actuator and the electromagnetic analysis of magnetic circuit to achieve dynamic characteristics. Also, magnetic force between tilt magnet and tilt yoke is investigated to and the influence on the DC sensitivity in the focus and track directions.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2003.11a
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• pp.208-213
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• 2003

A note-book PC has become thinner in recent years. And optical disc drives are required to have high memory capacity. Therefore, the actuator of optical disc drives must be thinner and have disc tilt compensation function for high density memory. In this paper, the hybrid type actuator is investigated for 3-axis ultra-slim actuator. A 3-axis ultra-slim actuator is designed by using the modal analysis of the actuator and the electromagnetic analysis of magnetic circuit to achieve dynamic characteristics and magnetic flux density for high sensitivity, respectively. Also, magnetic force between tilt magnet and tilt yoke is investigated to find the influence on the DC sensitivity in the focus and track directions.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2003.05a
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• pp.770-774
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• 2003

We propose the re-design method of modal parameters to depress the 2nd resonance peak of the ultra-slim-height optical pick-up actuator. With the addition of tile counter mode near the 2nd resonance frequency, we can achieve the gain margin which is sufficient to meet the system requirement. It would alleviate the burden of the additional filter for a high-speed drive.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.05a
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• pp.60-65
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• 2007

According to the customers' demands, cellular phones are getting thinner and thinner in spite that their functions are getting more complex and flexible. Based on this trend, we are willing to propose new design of ultra slim cellular phone with multi-hinges which can provide thinner feature and wider active area than the current merchandised one. To make it come true, smaller and stronger mechanical parts would be necessary and more researches would be carried out in the near future. Moreover, the new frame of ultra slim cellular phone has the problem in heat propagation due to its thin feature and multi function. In this paper, slim heat-spreader would be proposed as a candidate to resolve the problem of heat transfer in the new cellular phone. To investigate the applicability of heat-spreader to cellular phones, prototypes were fabricated and verified.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.107-107
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• 2004

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.214-217
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• 2008

We present an ultra-slim LCD module for 40-inch FHD TV. By employing edge-lit backlight system, module thickness of 10mm is achieved. To satisfy the luminance spec of 450 nits in FHD resolution, it is critical to adopt high efficient LED and optical components.

• The Transactions of the Korean Institute of Power Electronics
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• v.16 no.3
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• pp.274-282
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• 2011

The ultra slim U-I and W-I primary and pick-up coils for OLEV (On-Line Electric Vehicles) are proposed. With the proposed structures, the amount and the cost of the core are dramatically reduced. Not only air gap but also the lateral displacement are improved. The proposed structures are applied to the OLEV bus and SUV, which achieve 83% efficiency at 17cm air gap with more than 60kW output power, and the construction cost is lower than ￦300M/km. The proposed coil structures are verified with simulations and experiments.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.432-432
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• 2007

We studied optical simulation method for ultra slim backlight system. We designed 0.7mm thickness light guide plate and combined 48 white color LEDs for 12 inch wide size TFT-LCD. We designed flat shape PMMA light guide plate with both side patterned. It have vertical prism shape on upper side and ellipse dot pattern on the other side. We targeted 4500 nit brightness and uniform emission characteristic without hot spot or dark area. At first, we designed uniform emission area with more high brightness in center area and then, debugged light entering hot spot zone and direction of outgoing light flux. Although it was designing step, we obtained good result with reverse prism optical sheet and it had good repeatability because it was based on the stamper method in injection process without laser engraving or micro groove engraving method.

• 한국정보디스플레이학회:학술대회논문집
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• 2002.08a
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• pp.347-350
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• 2002

Transposed scan is an innovation that paves the road to ultra-slim CRTs with deflection angles up to 135$^{\circ}C$ We discuss the integration of video transposition with the other video processing functions in the television set. An in-place transposition algorithm which minimizes the amount of frame memory is proposed as a low-cost solution for transposed scan conversion. The difference in visual perception of transposed scan and normal scan depends on the frame rate and the line density of the video format. We found that for high frame rates and high line densities, no difference was perceived for both scan modes.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.1
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• pp.7-18
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• 2008

This paper reviews the current development of an ultra-slim SiP for Radio Frequency (RF) application, in which three flip chips, additional passive components and Surface Acoustic Wave (SAW) filters are integrated side-by-side. A systematic investigation is carried out for the design optimization, process and reliability improvement of the package, which comprises several aspects: a design study based on the 3D thermo-mechanical finite element analysis of the packaging, the determination of stress, warpage distribution, critical failure zones, and the figuration of the effects of material properties, process conditions on the reliability of package. The optimized material sets for manufacturing process were determined which can reduce the number of testing samples from 75 to 2. In addition the molded underfilling (MUF) process is proposed which not only saves one manufacturing process, but also improves the thermo-mechanical performance of the package compared with conventional epoxy underfilling process. In the end, JEDEC's moisture sensitivity test, thermal cycle test and pressure cooker tests have also been carried out for reliability evaluation. The test results show that the optimized ultra-slim SiP has a good reliability performance.