• Journal of Powder Materials
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• v.26 no.3
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• pp.201-207
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• 2019

Tungsten heavy alloys (W-Ni-Fe) play an important role in various industries because of their excellent mechanical properties, such as the excellent hardness of tungsten, low thermal expansion, corrosion resistance of nickel, and ductility of iron. In tungsten heavy alloys, tungsten nanoparticles allow the relatively low-temperature molding of high-melting-point tungsten and can improve densification. In this study, to improve the densification of tungsten heavy alloy, nanoparticles are manufactured by ultrasonic milling of metal oxide. The physical properties of the metal oxide and the solvent viscosity are selected as the main parameters. When the density is low and the Mohs hardness is high, the particle size distribution is relatively high. When the density is high and the Mohs hardness is low, the particle size distribution is relatively low. Additionally, the average particle size tends to decrease with increasing viscosity. Metal oxides prepared by ultrasonic milling in high-viscosity solvent show an average particle size of less than 300 nm based on the dynamic light scattering and scanning electron microscopy analysis. The effects of the physical properties of the metal oxide and the solvent viscosity on the pulverization are analyzed experimentally.

• KIEE International Transactions on Electrophysics and Applications
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• v.4C no.2
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• pp.68-72
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• 2004

The performance of copper-tungsten for electrodes used in an ultra high voltage interruption system was evaluated by means of an interruption test, which requires a large-scale apparatus and high cost. In this study, prior to the interruption test, the characteristics of a Cu-W electrode were estimated through the DC arc test, which is a simple, low cost procedure. The DC arc characteristics of a 20wt%Cu-80wt%W electrode were investigated with the change of tungsten powder size distribution and the addition of nickel. In specimens containing a high volume fraction of large sized tungsten particles, the relative density and hardness of sintered Cu-W electrodes increased while the electrical conductivity and the DC arc resistance decreased. Furthermore, the relative density became enhanced with the increase of the amount of nickel while the hardness and electrical conductivity diminished and the DC arc resistance worsened.

• Journal of the Korean Ceramic Society
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• v.31 no.10
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• pp.1159-1168
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• 1994

We powders were synthesized from W powders in differnet particle sizes by Self-propagating High-temperature Synthesis process (SHS) using a chemical furnace. The effects of the mole ratio of chemical fuel content, pellet thickness and the mole ratio between carbon and tungsten (C/W Ratio) on synthesis were investigated with the tungsten powders have different particle size each other. Compositional and structural characterization of these powders was carried out by scanning electron microscope (SEM0 and x-ray diffractometer. Powder characterization was carried out by the measurement of particle size distribution with laser-particle size analyzer. The amounts of WC obtained by SHS process depend very much on the particle size of tungsten powder and heat contents given in a product, i.e. as the particle size of W powder is smaller, the amounts of WC produced increase. Also the more heat contents is given, the more amounts of WC increase. By optimizing the synthesis conditions, it is possible to fabricate WC powders which have little secondary phases (W2C, C).

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09a
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• pp.654-655
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• 2006

This is about the effects deoxidization, carbonization and alloying preparation on fine grain W, WC, and grade YG8 powder reduced by "yellow tungsten oxide" and "blue tungsten oxide". The result indicates that yellow tungsten has single composition and blue tungsten oxide has complex composition. With this feature, yellow tungsten oxide got better uniformity and concentration distribution on fine particle size W and WC powder than blue tungsten oxide's. The grade alloy YG8 that made of this W or WC powder has uniform alloy construction, concentrated WC grain distribution and better alloy properties.

• Journal of Powder Materials
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• v.9 no.2
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• pp.89-95
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• 2002

Spherical fine powders of tungsten oxide powders were prepared by the emulsion evaporation method. The characteristics of the powders prepared were examined by means of TGA, X-ray diffraction, SEM and image analysis. The emulsions were prepared by fast mixing of aqueous phase containing tugsten and the organic phase which composed of kerosene, surfactant, and paraffin oil. Precursors were made by evaporating the emulsionin the kerosene bath at $160^{\circ}C$, and then calcined at $650^{\circ}C$ in order to produce tungsten oxide powders. The average particle size of the tungsten oxide powders was $0.5\mutextrm{m}$ and their shapes were spherical at the both case of w/o and o/w type emulsions. As the HLB value of the surfactant increased and the concentration of tungsten ions decreased the mean particle siqe of tungsten oxide powders decreased whereas agglomerationsize increased. The optimum concentration of Span 80 was 8 percent by volume, and the optimum stirring speed in the emulsion formation was 5000 rpm in order to obtain fine and well dispersed $WO_3$ powders.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.2
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• pp.156-161
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• 2004

We investigated the effects of oxidizer additive on the performance of Cu-CMP process using commonly used tungsten slurry. In order to compare the removal rate and non-uniformity as a function of oxidizer contents, we used alumina-based tungsten slurry and copper blanket wafers deposited by DC sputtering method. According to the CMP removal rates and particle size distribution, and the microstructures of surface layer by SEM image as a function or oxidizer contents were greatly influenced by the slurry chemical composition of oxidizers. The difference in removal rate and roughness of copper surface are believed to cause by modification in the mechanical behavior of $Al_2$O$_3$abrasive particles in CMP slurry.

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.1510-1515
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• 2004

The effects of additive ions on the generation of metallic nanoparticles were evaluated using a corona induced supersonic nozzle. Applying the corona discharge to the nanoparticle generator, a tungsten needle and the supersonic nozzle are used as an anode electrode and a cathode electrode respectively. The corona ions act as nuclei for the silver vapor condensation. The ion density was controlled precisely as varying the applied voltage between electrode and nozzle. The mean diameter of the silver particle decreases as the ion density increases. However, the number concentration of the silver particle tended to increase with the ion density. The size distribution is more uniform as the ion density increases.

• Proceedings of the KIEE Conference
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• 2006.07a
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• pp.603-604
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• 2006

We investigated the effects of oxidizer additive on the performance of Cu-CMP process using commonly used tungsten slurry. According to the CMP removal rates and particle size distribution, and the micro- structures of surface layer as a function of oxidizer contents were greatly influenced by the slurry chemical composition of oxidizers. The difference in removal rate and roughness of copper surface are believed to cause by modification in the mechanical behavior of $Al_{2}O_3$ abrasive particles in CMP slurry.

• Proceedings of the KIEE Conference
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• 2006.07b
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• pp.1269-1270
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• 2006

We investigated the effects of oxidizer additive on the performance of Cu-CMP process using commonly used tungsten slurry. According to the CMP removal rates and particle size distribution, and the micro-structures of surface layer as a function of oxidizer contents were greatly influenced by the slurry chemical composition of oxidizers. The difference in removal rate and roughness of copper surface are believed to cause by modification in the mechanical behavior of $Al_2O_3$ abrasive particles in CMP slurry.

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1729-1730
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• 2006

We investigated the effects of oxidizer additive on the performance of Cu-CMP process using commonly used tungsten slurry. According to the CMP removal rates and particle size distribution, and the micro-structures of surface layer as a function of oxidizer contents were greatly influenced by the slurry chemical composition of oxidizers. The difference in removal rate and roughness of copper surface are believed to cause by modification in the mechanical behavior of $Al_{2}O_{3}$ abrasive particles in CMP slurry.